Automatic Smt Online Solder Paste Inspection Machine Smt Spi
Machine Sinicktek smt 3D SPI S8080 Spi Machine
Product Specification
Parameters |
Technology Platform | Type-B/C Single Rail | Type-B/C Double rails | Type-B/C Plus |
Series | SHero/Ultra | S/Hero/Ultra | 1.2 m/1.5 m |
Model | S8080 /S2020/Hero/Ultra | S8080D /S2020D/HeroD/UltraD | L1200 /DL1200 /DL1500 |
Measurement Principle | 3D white light PSLM PMP(Programmable Spatial Light Modulation,
Phase Measurement Profilometry) |
Measurements | volume,acreage,height, XY offset, shape |
Detection of Non-Performing Types | missing print,insufficienttin, excessive tin, bridging, offset,
mal-shapes, surface contamination |
Lens Resolution | 4.5um/5um/6um/8um/10um/12um/15um/16um/18um/20um(针对不同相机型号可选) |
Accuracy | XY (Resolution):10um |
Repeatability | height:≤1um (4 Sigma);volume/acreage:<1%(4 Sigma); |
Gage R&R | <<10% |
Inspection Speed | 0.35 sec/FOV -0.5 sec/FOV (depending on the actual configuration) |
Quanlity of Inspection Head | Standard 1, matching 2,3 |
Mark-point Detection Time | 0.3sec/piece |
Maximun Meauring Head | ±550um (±1200um as option) |
Maximun Measuring Height of PCB Warp | ±5mm |
Minimun Pad Spacing | 100um -LRB-base pad height of 150um) 80um/100um/150um/200um
(depending on the actual configuration) |
Minimum element | 01005/03015/008004(Optional) | 01005/03015/008004(Optional) | 0201 |
Maximun Loading PCB Size(X*Y) | 450x450mm(B)Large platform with 630x550mm (InSPIre 630) | 450x310+450x310(B) 470x310+470x310(C) 630x310+630x310((large desktop) | 1200X650MM (measurable range 1200x650mm single segment) 600x2x650mm (measuring range 1200x550mm two-segment) |
Conveyor Setup | front orbit (back orbit as option) | 1 front orbit , 2,3,4 Dynamic Orbit | front orbit (back orbit as option) |
PCB Transfer Direction | Left to right or Right to left |
Conveyor Width Adjustment | manual & automatic |
SPC/Engineering Statistics | Histogram；Xbar-R Chart；Xbar-S Chart；CP&CPK；%Gage Repartability Data；SPI Daily/Weekly/Monthly Reports |
Gerber & CAD Data Import | support Gerber format(274x,274d),manual Teach model)；CAD X/Y,Part No.,Package Type imput) |
Operating System Support | Windows 10 Professional (64 bit) |
Equipment Diemension and Weight | W1000xD1150xH1530(B),965Kg W1000xD1174xH1550(C),985Kg | W1000xD1350xH1530(B),1200Kg W1000xD1350xH1550(C),1220Kg | W1730xD1420xH1530mm(single segment),1630Kg W1900xD1320xH1480mm(two-segment),1250Kg W2030xD1320xH1480(1500),1450Kg |
Optional | One person controls more machines,NetworkSPC(Software only ), 1D / 2D Barcode scanner,out-line programming software, UPS continuous power supply |
Core Technology and features
Principle of programmable structure grating PMP imaging technology
The phase modulation profilometry (PMP) is used to realize the 3D
measurement
of the solder paste in precision printing.
RGB Tune active tricolor, 2D lighting source
The patented RGB Tune feature solves the problems of bridge
miscalculation and relative datum uncertainty by taking
red-green-blue primary color photos alone and combining with a
unique color filtering algorithm, and provides 2D/3D measurements
at the same time, results the RGB color distortion caused by the
red light angle of the paste can be effectively avoided by using
the color solder paste picture and 2d light source The RGB
debugging versatility of different substrate colors greatly
improves the repeatability accuracy of the equipment (height,
volume, area) .
High-precision integrated control platform
High-strength steel structure, standard servo motor with
high-precision grinding ball screw, and guide rail, high-speed,
smooth movement. The selected linear motor and high-precision
grating ruler can be used to measure the solder paste of 03015
element with super-precision and high-speed, and the repeatability
precision can reach 1um.
Three-point photo function
Cooperate with different testing equipment on SMT production line,
such as Aoi in front and Aoi in back, to form a closed loop,
quality control system, and can synchronize data to quality control
system, such as ERP.
MES intelligent manufacturing access capability
SINICTEK developed a variety of data format ports, through the SPI
system can be simple, fast, accurate data transfer to the client of
the MES system.
Five-minute programming and one-click operation
By importing the Gerber module and friendly programming interface,
engineers of all levels can program independently, quickly and
accurately. The one-button operation designed for operators also
greatly reduces the pressure of training.
Application of 3D SPI in the field of ultra-dense solder paste
Miniled, MicroLED by a small LED lamp, the number of small leds on
a single board can reach more than 1 million pads, MiniLED's single
unit size is about 100-200 μm, and MicroLED's single unit size can
be in 50 μm; Therefore, the 3DSPI equipment used in the ultra-dense
products are used in the industry's highest configuration,
especially the marble platform, linear motor and grating ruler to
ensure the movement of small-size pad precision. By using the
leading telecentric lens with 1.8 μm resolution and optimizing the
Gerber transform, Load Job, algorithm, data saving and query, the
accuracy, speed and efficiency of detection are greatly improved.
Applications:
Widely used in electronics manufacturing, consumer electronics,
automobile electronics, communications equipment, aerospace,
medical equipment, LED lamps, computers and peripherals, smart
home, smart logistics, miniature and high power ratio electronic
devices.
