State - Of - The - Art Piezoelectric Wafer Fabrication For MEMS And SAW Devices Advanced Processing Capabilities For Results

State-of-the-Art Piezoelectric Wafer Fabrication for MEMS and SAW Devices Advanced Processing Capabilities for Results

We specialize in providing comprehensive chip foundry services, catering to clients who require high-quality wafer processing and fabrication. By simply providing design schematics and specifications, we deliver tailored solutions that meet your exact needs. Our extensive range of wafers includes Lithium Niobate (LiNbO₃), Lithium Tantalate (LiTaO₃), Single Crystal Quartz, Fused Silica Glass, Borosilicate Glass (BF33), Soda-Lime Glass, Silicon Wafers, and Sapphire, ensuring versatility for diverse applications.

Advanced Wafer Materials Portfolio‌
Our expertise spans industry-standard and exotic substrates:

• Lithium Niobate (LiNbO₃, 4"-6" wafers)
• Lithium Tantalate (LiTaO₃, Z-cut/Y-cut)
• Single Crystal Quartz (AT-cut/SC-cut)
• Fused Silica (Corning 7980 equivalent)
• Borosilicate Glass (BF33/Schott Borofloat®)
• Silicon (100/111 orientation, 200mm max)
• Sapphire (C-plane/R-plane, 2"–8")

‌Core Fabrication Technologies‌

1. ‌Lithography‌

   • Electron Beam Lithography (EBL, 10nm resolution)
   • Stepper Lithography (i-line, 365nm)
   • Proximity Mask Aligner (5μm alignment accuracy)

2. ‌Etching‌

   • ICP-RIE (SiO₂/Si etch rate 500nm/min)
   • DRIE (Aspect ratio 30:1, Bosch process)
   • Ion Beam Etching (Angular uniformity <±2°)

3. ‌Thin-Film Deposition‌

   • ALD (Al₂O₃/HfO₂, <1nm uniformity)
   • PECVD (SiNₓ/SiO₂, stress-controlled)
   • Magnetron Sputtering (Au/Pt/Ti, 5nm–1μm)

4. ‌Wafer Bonding‌

   • Anodic Bonding (Glass-to-Si, 400°C/1kV)
   • Eutectic Bonding (Au-Si, 363°C)
   • Adhesive Bonding (BCB/SU-8, <5μm warpage)

‌Supporting Process Infrastructure‌

• Precision Grinding (TTV <2μm)
• CMP Polishing (Ra <0.5nm)
• Laser Dicing (50μm kerf width)
• 3D Metrology (White-light interferometry)

Founded in 1999, Hangzhou Freqcontrol Electronic Technology Ltd. is a China leading manufacturer of piezoelectric crystal wafers, substrates, components and single crystal growth. We, known as the "CQT Group" in global market, headquartered in Hangzhou, China, empowered by its manufacturing sites in Shanghai, Jiaxing and Deqin etc.

Our products are mainly used in RF Telecom, Semiconductor, Biotech, Optical engineering and frequency control industries. The monthly production capacity: 500K single quartz blanks (SC, AT, IT, FC, etc.), 20K quartz wafers (AT, ST, X, Z, etc.), 10K LiNbO3 wafers (3~8 inch), 10K glass wafers (Fused silica, Borofloat33, Corning, etc.), 8K LiTaO3 wafers (3~6 inch), and 100K filters/oscillators (VCXO, TCXO).

Our company vision is to be a reliable primary Microelectronic substrates supplier in today's world.

The CQT Group consists of five major plants with total floor area over 10,000 m². Our production machines include crystal growth furnace, wire saw, X-ray orientation, grinding machine, polishing machine, chamfering machine, CNC, REDOX chambers etc. Inspection equipment include Flatmaster 200, AOI, profilometer, optical imager, X-ray inspector etc. We are also equipped with Class 100 and 1000 clean rooms.

The CQT group is primarily known as the expert of hexagonal crystals, We master the manufacturing process of single & doubly rotated quartz blanks, and we can provide quartz of any orientation cut whether given by IRE , Miller index, Euler angle or conventional sign.

In addition to our leading quartz blank manufacturing capabilities, the last decade sees our major technological breakthroughs. We overcome the 3~6 inch ultra-thin wafer mass production barrier, obtained the reduction technology of black LiNbO3 & LiTaO3 wafers, and achieved 8 inch LiNbO3 wafer mass production successfully.

Competitive Advantages

1. Reliable partner: We are in this business for over 30 years, served over 200 customers in 20+ countries.
2. Complete production line: We do crystal orientation, wire cut, grinding, polishing, etching, flat/notch, surface inspecting, x-ray detecting etc. all in house!
3. State-of-the-art cleanroom: We have 3 Class1000 clean room, 1 Class100 work desk, complete wafer cleaning & drying process.
4. Efficient customer service: Prompt RFQ response & Order confirmation in 24 hrs, customization lead time in 4 weeks.