Applications: high-power semiconductor module; Semiconductor
cooler, electronic heater; Power control circuit, power mixing
circuit. Intelligent power module; High frequency switching power
supply, solid state relay. Automotive electronics, aerospace and
military electronics components. Solar panel components;
Telecommunications private exchange, receiving system; Laser and
other industrial electronics. . Ceramic substrate features:
1. High thermal conductivity to meet device heat dissipation
requirements;
2. Good heat resistance, meet the power device high temperature
(more than 200℃) application requirements;
3. Match the thermal expansion coefficient, match the thermal
expansion coefficient of the chip material, reduce the thermal
stress of the package;
4. Small dielectric constant, good high-frequency characteristics,
reduce the device signal transmission time, improve the signal
transmission rate;
5. High mechanical strength to meet the requirements of mechanical
properties in the process of device packaging and application;
6. Good corrosion resistance, able to withstand strong acid, strong
alkali, boiling water, organic solution and other erosion;
7. Compact structure to meet the requirements of electronic device
airtight packaging
