Application:
high-power power semiconductor module; Semiconductor refrigerator,
electronic heater; Power control circuit, power hybrid circuit. Intelligent power components; High frequency
switching power supply, solid state relay. Automotive electronics,
aerospace and military electronic components. Solar panel assembly;
Telecommunications private exchange, receiving system; Laser and
other industrial electronics.
High thermal conductivity, meeting the heat dissipation
requirements of devices;
Good heat resistance, meeting the high-temperature (more than 200℃)
application requirements of power devices;
Thermal expansion coefficient matching, matching with the thermal
expansion coefficient of chip material, reducing packaging thermal
stress;
Low dielectric constant, good high frequency characteristics,
reducing the signal transmission time of the device and improving
the signal transmission rate;
High mechanical strength, meeting the requirements of mechanical
properties in the process of device packaging and application;
Good corrosion resistance, able to withstand strong acid, strong
alkali, boiling water, organic solution and other corrosion;
Compact structure, meeting the requirements of airtight packaging
of electronic devices;
