TIF100C 6530-11 Excellent Thermal Conductivity 8.0W/MK Thermal Gap
Filler Pad For CPU And GPU Processors
Product descriptions
TS-TIF®100C 6530-11 series is a silicone-based thermal material designed to fill the
gaps between heat-generating components and liquid cooling plates
or metal bases.lts flexibility and elasticity make it ideal for
covering highly uneven surfaces.With excellent thermal
conductivity, it efficiently transfers heat from heat-generating
elements or PCBs to liquid cooling plates or metal heat dissipation
structures, thereby improving the cooling efficiency of high-power
electronic components and extending the lifespan of the equipment.
Features:
>Excellent thermal conductivity 6.5W/mK
>Self-adhesive without the need for additional surface adhesive
>Highly compressible, soft, and elastic
>Available in various thicknesses
>Good chemical stability
Applications:
>CPU and GPU processors and other chipsets
>High-performance computing (HPC)
>Industrial equipment
>Network communication devices
>New energy vehicles
| Typical Properties of TS-TIF®100C 6530-11 Series |
| Color | Gray | Visual |
| Construction & Compostion | Ceramic filled silicone elastomer | ****** |
| Specific Gravity | 3.4g/cc | ASTM D297 |
| thickness | 0.012"(0.30mm)~0.200"(5.00mm) | ASTM D374 |
| Hardness (thickness＜1.0mm) | 30 (Shore 00) | ASTM 2240 |
| Continuos Use Temp | -45 to 200℃ | ****** |
| Dielectric Breakdown Voltage | ≥5500 VAC | ASTM D149 |
| Dielectric Constant | 7.0MHz | ASTM D150 |
| Volume Resistivity | ≥1.0X10¹²Ohm-meter | ASTM D257 |
| Fire rating | 94 V0 | equivalent UL |
| Thermal conductivity | 6.5W/m-K | ASTM D5470 |
Standard Thicknesses:
0.020" (0.51mm) 0.030" (0.76mm)
0.040" (1.02mm) 0.050" (1.27mm) 0.060" (1.52mm)
0.070" (1.78mm) 0.080" (2.03mm) 0.090" (2.29mm)
0.100" (2.54mm) 0.110" (2.79mm) 0.120" (3.05mm)
0.130" (3.30mm) 0.140" (3.56mm) 0.150" (3.81mm)
0.160" (4.06mm) 0.170" (4.32mm) 0.180" (4.57mm)
0.190" (4.83mm) 0.200" (5.08mm)
Consult the factory to alternate thickness.
Product Specification
Product Thicknesses: 0.012"(0.30mm)-0.200"(5.00mm)
Product Sizes:8" x 16"(203mm x406mm)
Custom die-cut shapes and thicknesses are available.Please contact
us for details.
Store in a cool, dry place, away from fire and sunlight.
Packaging Details & Lead time
The packaging of thermal pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated
Company Profile
With a wide range, good quality, reasonable prices and stylish
designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks,
DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power
products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED
Server Power products and others.
Certifications:
ISO9001:2015
ISO14001: 2004 IATF16949:2016
IECQ QC 080000:2017
UL
Our services
Online-service : 12 hours , Inquiry reply within fastest.
Working time: 8:00am - 5:30pm, Monday to Saturday (UTC+8).
Well-trained & experienced staff are to answer all your inquiries
in English of course.
Standard Export Carton Or Marked With Customer's Information Or
Customized.
Provide free samples
After-service: Even our products have passed strict inspection, if
you find the parts can not work well, please show us the proof.
we will help you to deal with it and give you satisfactory
solution.
