Chip Foundry Services Lithography Etching Coating Bonding Thinning

Our Chip Foundry Services

Lithography Etching Coating Bonding Thinning

CQT GROUP specializes in providing comprehensive chip foundry services, catering to clients who require high-quality wafer processing based on their design specifications and requirements. Our advanced fabrication capabilities cover a wide range of processes, including lithography, etching, coating, thinning, bonding, cutting, and drilling, ensuring end-to-end solutions for your custom projects.

Wafer Materials

We work with a diverse selection of wafer materials to meet various application needs, including:

• Lithium Niobate (LiNbO₃)
• Lithium Tantalate (LiTaO₃)
• Single Crystal Quartz
• Fused Silica (Synthetic Quartz Glass)
• Borosilicate Glass (BF33)
• Soda-Lime Glass
• Silicon Wafers
• Sapphire

Key Fabrication Technologies

Our state-of-the-art facilities and expertise enable us to deliver precision and reliability across multiple fabrication stages:

1. Lithography

• Electron Beam Lithography (EBL)
• Proximity Lithography
• Stepper Lithography

2. Etching

• Ion Beam Etching (IBE)
• Deep Reactive Ion Etching (DRIE)
• Reactive Ion Etching (RIE)

3. Coating

• Electron Beam Evaporation
• Magnetron Sputtering
• Low-Pressure Chemical Vapor Deposition (LPCVD)
• Plasma-Enhanced Chemical Vapor Deposition (PECVD)
• Atomic Layer Deposition (ALD)

4. Bonding

• Anodic Bonding
• Eutectic Bonding
• Adhesive Bonding
• Wire Bonding
• Supporting Equipment

To ensure the highest quality and precision, our facility is equipped with advanced supporting machinery, including:

• Grinding Machines
• Thinning Machines
• Polishing Machines
• Dicing Machines
• Successful Projects

We have successfully delivered a variety of custom projects, including:

• Surface Acoustic Wave (SAW) Interdigital Transducers
• Lithium Niobate Ring Transducers
• Microfluidic Chips
• Custom MEMS Designs

Why Choose Us?

• End-to-End Solutions: From wafer selection to final product, we handle every step with precision.
• Advanced Technologies: Cutting-edge equipment and processes ensure superior quality.
• Customization: Tailored solutions to meet your specific design and performance requirements.
• Proven Expertise: A track record of successful projects across diverse applications.

Whether you are developing advanced MEMS devices, microfluidic systems, or specialized transducers, our foundry services are designed to bring your designs to life with unmatched precision and reliability. Partner with us to transform your innovative ideas into high-performance products.

Founded in 1999, Hangzhou Freqcontrol Electronic Technology Ltd. is a China leading manufacturer of piezoelectric crystal wafers, substrates, components and single crystal growth. We, known as the "CQT Group" in global market, headquartered in Hangzhou, China, empowered by its manufacturing sites in Shanghai, Jiaxing and Deqin etc.

Our products are mainly used in RF Telecom, Semiconductor, Biotech, Optical engineering and frequency control industries. The monthly production capacity: 500K single quartz blanks (SC, AT, IT, FC, etc.), 20K quartz wafers (AT, ST, X, Z, etc.), 10K LiNbO3 wafers (3~8 inch), 10K glass wafers (Fused silica, Borofloat33, Corning, etc.), 8K LiTaO3 wafers (3~6 inch), and 100K filters/oscillators (VCXO, TCXO).

Our company vision is to be a reliable primary Microelectronic substrates supplier in today's world.

The CQT Group consists of five major plants with total floor area over 10,000 m². Our production machines include crystal growth furnace, wire saw, X-ray orientation, grinding machine, polishing machine, chamfering machine, CNC, REDOX chambers etc. Inspection equipment include Flatmaster 200, AOI, profilometer, optical imager, X-ray inspector etc. We are also equipped with Class 100 and 1000 clean rooms.

The CQT group is primarily known as the expert of hexagonal crystals, We master the manufacturing process of single & doubly rotated quartz blanks, and we can provide quartz of any orientation cut whether given by IRE , Miller index, Euler angle or conventional sign.

In addition to our leading quartz blank manufacturing capabilities, the last decade sees our major technological breakthroughs. We overcome the 3~6 inch ultra-thin wafer mass production barrier, obtained the reduction technology of black LiNbO3 & LiTaO3 wafers, and achieved 8 inch LiNbO3 wafer mass production successfully.

Competitive Advantages

1. Reliable partner: We are in this business for over 30 years, served over 200 customers in 20+ countries.
2. Complete production line: We do crystal orientation, wire cut, grinding, polishing, etching, flat/notch, surface inspecting, x-ray detecting etc. all in house!
3. State-of-the-art cleanroom: We have 3 Class1000 clean room, 1 Class100 work desk, complete wafer cleaning & drying process.
4. Efficient customer service: Prompt RFQ response & Order confirmation in 24 hrs, customization lead time in 4 weeks.