Revolutionizing Chip Fabrication Precision Innovation and Excellence

Revolutionizing Chip Fabrication Precision Innovation and Excellence

At the forefront of advanced chip foundry services, we empower innovation by transforming your design concepts into high-performance semiconductor and MEMS devices. With state-of-the-art facilities and a team of seasoned experts, we offer end-to-end solutions tailored to your unique requirements. Simply provide your design schematics and specifications, and we handle the rest—delivering precision-engineered wafers and components that meet the most demanding standards.

Our extensive portfolio of wafer materials includes Lithium Niobate (LiNbO₃), Lithium Tantalate (LiTaO₃), Single Crystal Quartz, Fused Silica Glass, Borosilicate Glass (BF33), Soda-Lime Glass, Silicon Wafers, and Sapphire, enabling us to support a wide range of applications across industries.

Cutting-Edge Processing Technologies

• Lithography:
  • Electron Beam Lithography (EBL): Ideal for ultra-high-resolution patterning, enabling nanoscale features for advanced photonic and quantum devices.
  • Proximity Lithography: Cost-effective solution for microfluidic chips and MEMS sensors.
  • Stepper Lithography: High-throughput, high-precision patterning for large-area wafers, perfect for integrated circuits (ICs) and optical components.
• Etching:
  • Ion Beam Etching (IBE): Delivers smooth, anisotropic etching for high-precision optical and acoustic wave devices.
  • Deep Reactive Ion Etching (DRIE): Enables high-aspect-ratio structures for MEMS accelerometers, gyroscopes, and inertial sensors.
  • Reactive Ion Etching (RIE): Versatile etching for thin-film transistors (TFTs) and microfluidic channels.
• Coating:
  • Electron Beam Evaporation: Deposits high-purity thin films for optoelectronic devices and superconducting circuits.
  • Magnetron Sputtering: Produces uniform coatings for RF filters, SAW devices, and protective layers.
  • LPCVD/PECVD/ALD: Advanced deposition techniques for dielectric layers, passivation, and nanostructured coatings.
• Bonding:
  • Anodic Bonding: Creates hermetic seals for MEMS pressure sensors and microfluidic devices.
  • Eutectic Bonding: Ensures robust, low-resistance interconnects for power electronics and LED packaging.
  • Adhesive/Wire Bonding: Provides flexible solutions for hybrid integration and IC packaging.
• Thinning, Cutting, and Drilling:
  • Precision Grinding and Thinning: Achieves ultra-thin wafers for flexible electronics and advanced packaging.
  • Dicing and Cutting: Enables clean, precise separation of dies for ICs and MEMS devices.
  • Laser Drilling: Creates micro-vias and through-silicon vias (TSVs) for 3D integration and interconnects.

Success Stories: Transforming Ideas into Reality

Our proven expertise has enabled groundbreaking innovations across multiple industries:

• Surface Acoustic Wave (SAW) Devices: Fabricated high-performance SAW filters and sensors for 5G communications and IoT applications.
• Lithium Niobate Ring Transducers: Delivered ultra-sensitive transducers for quantum computing and photonic circuits.
• Microfluidic Chips: Enabled lab-on-a-chip solutions for biomedical diagnostics and drug discovery.
• MEMS Accelerometers and Gyroscopes: Produced high-precision inertial sensors for automotive and aerospace systems.
• Optical Waveguides: Fabricated low-loss waveguides for integrated photonics and LiDAR systems.

Why Choose Us?

• End-to-End Solutions: From design consultation to final packaging, we provide seamless support for your projects.
• Material Versatility: Access to a wide range of wafer materials for diverse applications.
• Advanced Technologies: Leveraging the latest fabrication techniques to deliver superior performance.
• Proven Expertise: A track record of successful projects across industries, from telecommunications to healthcare.

Partner with us to unlock the full potential of your designs. Whether you're developing next-generation MEMS devices, photonic circuits, or microfluidic systems, we are your trusted partner in innovation. Let’s redefine the future of technology together.

Founded in 1999, Hangzhou Freqcontrol Electronic Technology Ltd. is a China leading manufacturer of piezoelectric crystal wafers, substrates, components and single crystal growth. We, known as the "CQT Group" in global market, headquartered in Hangzhou, China, empowered by its manufacturing sites in Shanghai, Jiaxing and Deqin etc.

Our products are mainly used in RF Telecom, Semiconductor, Biotech, Optical engineering and frequency control industries. The monthly production capacity: 500K single quartz blanks (SC, AT, IT, FC, etc.), 20K quartz wafers (AT, ST, X, Z, etc.), 10K LiNbO3 wafers (3~8 inch), 10K glass wafers (Fused silica, Borofloat33, Corning, etc.), 8K LiTaO3 wafers (3~6 inch), and 100K filters/oscillators (VCXO, TCXO).

Our company vision is to be a reliable primary Microelectronic substrates supplier in today's world.

The CQT Group consists of five major plants with total floor area over 10,000 m². Our production machines include crystal growth furnace, wire saw, X-ray orientation, grinding machine, polishing machine, chamfering machine, CNC, REDOX chambers etc. Inspection equipment include Flatmaster 200, AOI, profilometer, optical imager, X-ray inspector etc. We are also equipped with Class 100 and 1000 clean rooms.

The CQT group is primarily known as the expert of hexagonal crystals, We master the manufacturing process of single & doubly rotated quartz blanks, and we can provide quartz of any orientation cut whether given by IRE , Miller index, Euler angle or conventional sign.

In addition to our leading quartz blank manufacturing capabilities, the last decade sees our major technological breakthroughs. We overcome the 3~6 inch ultra-thin wafer mass production barrier, obtained the reduction technology of black LiNbO3 & LiTaO3 wafers, and achieved 8 inch LiNbO3 wafer mass production successfully.

Competitive Advantages

1. Reliable partner: We are in this business for over 30 years, served over 200 customers in 20+ countries.
2. Complete production line: We do crystal orientation, wire cut, grinding, polishing, etching, flat/notch, surface inspecting, x-ray detecting etc. all in house!
3. State-of-the-art cleanroom: We have 3 Class1000 clean room, 1 Class100 work desk, complete wafer cleaning & drying process.
4. Efficient customer service: Prompt RFQ response & Order confirmation in 24 hrs, customization lead time in 4 weeks.