Product Highlights
- High-Precision Positioning
Centimeter-to-meter level accuracy with multi-constellation support
(GPS/GLONASS/Galileo/BeiDou).
- Ultra-Low Power Consumption
Optimized power management for extended battery life (e.g., <1mA
in sleep mode).
NMEA 0183 compliant protocols, with customizable message formats.
- Versatile Interface Options
Supports UART, I2C, SPI, USB, and CAN bus for flexible integration.
- Wide Voltage Range Operation
Compatible with 2.7V–5.5V inputs, ideal for industrial and
battery-powered applications.
- Compact and Lightweight Design
Miniaturized form factor (e.g., 12mm × 16mm) for space-constrained
installations.
- Plug-and-Play Connectivity
Standardized connectors (e.g., JST, SMA) for effortless deployment.
- Multi-Scenario Adaptability
Ruggedized for drones, vehicles, wearables, and IoT devices (-40°C
to +85°C rated).
Tailored firmware, antenna designs, and housing options upon
request.
Parameters of YW-16162G3 Global Positioning System Module
| Item | Parameters |
| Part No. | YW-35254Z1 |
| Chip | As per order |
| Frequency | L1 |
| Number of Channels | As per order requirements |
| Positioning Accuracy | 2 to 5meters |
| Velocity | 515 m/s |
| Velocity Accuracy | Without aid : 0.1m/s
DGPS: 0.05m/s |
| TTFF | Hot start: 1 second typical
Warm start: 28 seconds typical
Cold start: 30 seconds typical |
| Sensitivity | Tracking Sensitivity: -162 dBm
Acquisition Sensitivity: -160 dBm typical
Cold Start:-147dBm |
| Baud Rate | 9600 bps (default) or customized |
| Navigation Update Rate | 1Hz (default), maximum 10Hz |
| Timing Accuracy | 25 ns RMS |
| Interface Options | UART, I2C, SPI, USB, CAN |
| Data Output Format | NMEA 0183 |
| Power Supply | 3V ~ 5V |
| Working Temperature Range | -40°C to 85°C |
| Antenna Type | patch ceramic antenna |
| AGPS | Supported |
| Dimension | 35*25*4mm |
| Package Type | SMD |
| Origin Place | China |
| Export Packing | Tray/Carton |
GPS Module Customization Service Process
1. Embedded Software Development
| Step | Process Description | Key Activities |
| 1 | Requirements Analysis | Define functional specs (e.g., AT commands, protocols). |
| 2 | Dev Environment Setup | Configure IDE/toolchain (e.g., Keil, GCC). |
| 3 | Algorithm Optimization | Enhance positioning accuracy/power efficiency. |
| 4 | Protocol Integration | Add TCP/UDP or custom communication protocols. |
| 5 | Driver Development | Hardware-software compatibility testing. |
| 6 | Maintainability Design | Modular code architecture for future upgrades. |
Deliverables: SDK package, AT command documentation, test reports.
2. APP & Web Development
| Step | Process Description | Key Activities |
| 1 | Requirement Finalization | Confirm features (e.g., geofencing, alerts). |
| 2 | UI/UX Design | Cross-platform responsive design (iOS/Android/Web). |
| 3 | API & Backend Development | RESTful APIs, database design (PostgreSQL/MongoDB). |
| 4 | Security Implementation | Data encryption (AES-256), OAuth 2.0 authentication. |
| 5 | Performance Tuning | Server load balancing, latency optimization. |
| 6 | Deployment & Testing | AWS/Azure deployment, stress testing (JMeter). |
Deliverables: Mobile apps (APK/IPA), admin dashboard, API documentation.
3. PCBA Turnkey Manufacturing
| Step | Process Description | Key Activities |
| 1 | Design Review | Schematic/PCB layout validation (Altium/Cadence). |
| 2 | Rapid Prototyping | 24-72hr PCB fabrication (4-6 layer options). |
| 3 | Component Sourcing | BOM procurement with OEM/ODM partners. |
| 4 | SMT Assembly | High-precision pick-and-place. |
| 5 | Functional Testing | In-circuit test (ICT), firmware flashing. |
| 6 | Quality Assurance | Burn-in testing, RoHS/REACH compliance checks. |
Deliverables: Tested PCBA units, compliance certificates, assembly logs.
4. GPS Hardware Customization
| Step | Process Description | Key Activities |
| 1 | Mechanical Design | Custom housing/antenna (3D modeling with SolidWorks). |
| 2 | RF Optimization | LNA circuit tuning, impedance matching. |
| 3 | Environmental Testing | Thermal cycling (-40°C to +85°C), vibration tests. |
| 4 | Signal Validation | Anechoic chamber testing, multi-constellation SNR analysis. |
| 5 | Mass Production | DFM review, mold/tooling fabrication. |
Deliverables: 3D design files, RF test reports, production jigs.
End-to-End Collaboration
Bilingual Support: Dedicated project managers with technical translators.
Agile Milestones: Bi-weekly sprints with demo sessions.
Post-Sales: OTA update portal, RMA process for hardware.
