Ultra-Low Thermal Resistance 9W/MK Carbon Fibre Based Thermal Pad
For 5G Communication Equipment
TS-TIR®700-09 Series series is a high-performance carbon-based thermal pad that
combines highly thermally conductive carbon fiber with polymer
silicone materials. Utilizing advanced manufacturing processes to
precisely distribute thermal pathways, it achievese xceptional
thermal conductivity, effectively reducing interfacial thermal
resistance and enhancing heat dissipation efficiency. With its
ultra-thin, lightweight design and mechanical flexibility, it is
suitable for 5G equipment, high-performance chips, and other high
heat flux applications.
Feature
>Good thermal conductivity 9w/mK
>Ultra-low thermal resistance
>works under low pressure.
>Non-insulating material
>Non-adhesive surface
Application
>Between chips and heat dissipation modules
>5G communication equipment
>Optoelectronics industry
>wearable devices
| Typical Properties of TIR®700-09 series |
| Product Name | TIR®700-09 | Test Method |
| Colour | Gray | Visual |
| Construction | Carbon fiber filled silicone | ***** |
| Thickness range | 0.04"~0.20"(1.0~5.0 mm) | ASTM D374 |
| Hardness | 55±10 Shore A | ASTM D2240 |
| Density | 2.1 g/cc | ASTM D792 |
| Operation Temperature | -40℃~ 200℃ | ****** |
| Thermal impedance | 9.0W/m-K | ASTM D5470 |
| Specific heat capacity (J/g ℃) | 0.93 | ASTM E1269 @25℃ |
| Flame Rating | V-0 | UL94 |
| RoHS | Compliant | IEC62321 |
Product Specification
Standard Thickness:0.04" (1.0mm), 0.06" (1.5mm),0.08" (2.0mm),0.10"
(2.5mm),0.12" (3.0mm)
Standard Size: 1.9"x 1.97"(50.0mm x 50.0mm)
