At bicheng, we specialize in delivering state-of-the-art PCB
solutions that push the boundaries of performance and reliability.
Our Rogers RO4350B PCBs are engineered to meet the most demanding
requirements of RF and microwave applications, offering unmatched
electrical performance, thermal stability, and cost efficiency.
Whether you're developing cellular base stations, automotive radar
systems, or satellite communication devices, our RO4350B PCBs are
the perfect choice for your next breakthrough project.
Why Rogers RO4350B Stands Out
Rogers RO4350B is a game-changing material that bridges the gap
between high-performance PTFE laminates and cost-effective
epoxy/glass solutions. Here’s what makes it exceptional:
Unmatched Electrical Performance: With a tightly controlled
dielectric constant (Dk) of 3.48 +/- 0.05 at 10 GHz/23°C and an
ultra-low dissipation factor of 0.0037 at 10 GHz/23°C, RO4350B
ensures superior signal integrity and minimal loss, even at high
frequencies.
Thermal Excellence: A high glass transition temperature (Tg) of
>280°C and a thermal conductivity of 0.69 W/m/°K make it ideal
for high-power and high-temperature environments.
Dimensional Stability: Its CTE (coefficient of thermal expansion)
closely matches that of copper (X: 10 ppm/°C, Y: 12 ppm/°C, Z: 32
ppm/°C), ensuring exceptional dimensional stability for multi-layer
board constructions.
Cost-Effective Manufacturing: Unlike traditional PTFE materials,
RO4350B can be processed using standard FR-4 methods, significantly
reducing production costs without compromising quality.
| RO4350B Typical Value |
| Property | RO4350B | Direction | Units | Condition | Test Method |
| Dielectric Constant,εProcess | 3.48±0.05 | Z | | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 Clamped Stripline |
| Dielectric Constant,εDesign | 3.66 | Z | | 8 to 40 GHz | Differential Phase Length Method |
| Dissipation Factortan,δ | 0.0037
0.0031 | Z | | 10 GHz/23℃
2.5 GHz/23℃ | IPC-TM-650 2.5.5.5 |
| Thermal Coefficient of ε | +50 | Z | ppm/℃ | -50℃to 150℃ | IPC-TM-650 2.5.5.5 |
| Volume Resistivity | 1.2 x 1010 | | MΩ.cm | COND A | IPC-TM-650 2.5.17.1 |
| Surface Resistivity | 5.7 x109 | | MΩ | COND A | IPC-TM-650 2.5.17.1 |
| Electrical Strength | 31.2(780) | Z | Kv/mm(v/mil) | 0.51mm(0.020") | IPC-TM-650 2.5.6.2 |
| Tensile Modulus | 16,767(2,432)
14,153(2,053) | X
Y | MPa(ksi) | RT | ASTM D 638 |
| Tensile Strength | 203(29.5)
130(18.9) | X
Y | MPa(ksi) | RT | ASTM D 638 |
| Flexural Strength | 255
(37) | | MPa
(kpsi) | | IPC-TM-650 2.4.4 |
| Dimensional Stability | <0.5 | X,Y | mm/m
(mil/inch) | after etch+E2/150℃ | IPC-TM-650 2.4.39A |
| Coefficient of Thermal Expansion | 10
12
32 | X
Y
Z | ppm/℃ | -55℃to288℃ | IPC-TM-650 2.4.41 |
| Tg | >280 | | ℃ TMA | A | IPC-TM-650 2.4.24.3 |
| Td | 390 | | ℃ TGA | | ASTM D 3850 |
| Thermal Conductivity | 0.69 | | W/M/oK | 80℃ | ASTM C518 |
| Moisture Absorption | 0.06 | | % | 48hrs immersion 0.060"
sample Temperature 50℃ | ASTM D 570 |
| Density | 1.86 | | gm/cm3 | 23℃ | ASTM D 792 |
| Copper Peel Stength | 0.88
(5.0) | | N/mm
(pli) | after solder float 1 oz.
EDC Foil | IPC-TM-650 2.4.8 |
| Flammability | (3)V-0 | | | | UL 94 |
| Lead-free Process Compatible | Yes | | | | |
Our RO4350B PCB Specifications
We offer 2-layer rigid PCBs designed to meet the highest industry
standards. Here’s what you can expect:
Board Dimensions: 340 mm x 340 mm (1PCS), with a precision
tolerance of +/- 0.15 mm.
Layer Stackup:
Copper Layer 1: 35 μm
Rogers RO4350B Core: 0.102 mm (4 mil)
Copper Layer 2: 35 μm
Trace/Space: Minimum 4/5 mils for intricate designs.
Hole Size: Minimum 0.25 mm for reliable connections.
Finished Board Thickness: 0.2 mm, ensuring lightweight yet durable
construction.
Surface Finish: Immersion Gold for enhanced solderability and
long-term reliability.
Quality Assurance: Every board undergoes 100% electrical testing
and complies with IPC-Class-2 standards.
Why Choose RO4350B PCBs?
Perfect for Multi-Layer Designs: Ideal for complex,
mixed-dielectric multi-layer board constructions.
Cost-Effective Production: Utilizes standard FR-4 processing,
reducing manufacturing costs.
Reliability You Can Trust: Exceptional dimensional stability and
plated through-hole quality, even under extreme thermal conditions.
Competitive Pricing: High-performance laminates at a fraction of
the cost of traditional microwave materials.
Applications That Inspire Innovation
This RO4350B PCBs are trusted in a wide range of high-frequency and
high-power applications, including:
Cellular Base Station Antennas and Power Amplifiers
RF Identification Tags
Automotive Radar and Sensor Systems
LNBs for Direct Broadcast Satellites
Global Availability, Uncompromising Quality
We are committed to delivering excellence worldwide. Our PCBs are
manufactured to IPC-Class-2 standards, ensuring reliability and
performance in every application. No matter where you are, we’ve
got you covered with seamless logistics and timely delivery.
Your Next Step: Let’s Build Something Extraordinary!
Ready to take your designs to the next level? Our Rogers RO4350B
PCBs combine precision, performance, and affordability to help you
achieve your goals. Contact us today to request a quote or discuss
your project requirements. Let’s collaborate to create solutions
that set new benchmarks in innovation.
