Product Description:
In today's rapidly developing modern technology, the performance of
electronic devices is constantly improving. Along with this comes a
large amount of heat generated during the operation of the devices.
How to achieve efficient heat dissipation has become a key factor
in ensuring the stable operation of devices and extending their
service life. Our ceramic heat sinks, with their excellent
performance and unique design, have become the ideal choice for
solving heat dissipation problems.
I. Exceptional Material for Worry - Free Heat Dissipation
- High Thermal Conductivity: This ceramic heat sink is made of advanced ceramic materials, and
its thermal conductivity far exceeds that of traditional metal heat
sinks. With efficient heat conduction performance, it can quickly
transfer the heat generated inside the device, ensuring that the
device always operates at an appropriate temperature.
- Good Thermal Stability: Ceramic materials have excellent thermal stability and can still
maintain stable heat dissipation performance in high - temperature
environments. Whether in the hot summer or when the device is
running under high load for a long time, the ceramic heat sink can
reliably play its role in heat dissipation and ensure the normal
operation of the device.
- Excellent Insulation Performance: Different from metal heat sinks, ceramic heat sinks have
excellent insulation performance. This characteristic can
effectively avoid the risk of short - circuit caused by the heat
sink when used in electronic devices, improving the safety and
reliability of the device.
II. Exquisite Design for Outstanding Performance
- Optimized Heat Dissipation Structure: The carefully designed heat sink structure greatly increases the
heat dissipation area. The unique fin design can make full use of
the principle of air convection to accelerate the dissipation of
heat and further improve the heat dissipation efficiency.
- Lightweight and Robust: While ensuring excellent heat dissipation performance, the
ceramic heat sink is relatively light in weight, reducing the
overall burden on the device. At the same time, the high strength
of ceramic materials gives it good impact - resistance and
vibration - resistance, adapting to various complex usage
environments.
- Convenient Installation: The product design fully considers the convenience of
installation and is equipped with simple and easy - to - use
installation accessories. Whether in the device manufacturing
process or during later maintenance and replacement, the
installation can be easily completed, saving time and labor costs.
III. Wide Applications to Meet Diverse Needs
- Electronic Device Field: It is suitable for CPU and GPU radiators of computers,
effectively reducing the chip temperature, improving computer
performance, and reducing lag. In mobile devices such as mobile
phones and tablets, the ceramic heat sink can help the processor
dissipate heat quickly, ensuring the smooth operation of the device
during long - term use and avoiding the problem of frequency
reduction caused by overheating.
- Industrial Control Field: Industrial automation equipment, servers, etc. have extremely
high requirements for heat dissipation. The ceramic heat sink can
provide reliable heat dissipation guarantee for these devices,
ensuring the stable operation of the devices in harsh industrial
environments, reducing the probability of failures, and improving
production efficiency.
- Communication Equipment Field: Communication equipment such as 5G base stations and routers
generate a large amount of heat during operation. The efficient
heat dissipation performance of the ceramic heat sink can meet the
strict heat dissipation requirements of these devices, ensuring the
stable transmission of signals and improving communication quality.
Choosing our ceramic heat sink means choosing an efficient and
reliable heat dissipation solution for your device. We are
committed to providing customers with high - quality products and
professional services, helping your technology products to achieve
the best performance under the guarantee of efficient heat
dissipation.
Features:
- Product Name: Ceramic Heat Sink
- Temperature Resistance: ＜700℃
- Surface Roughness: 0.3-0.8 Um
- Density: 3.7g/cm^3
- Material: Ceramic, SiC, Al₂O₃, SiO₂, Al₄C₃
- Mechanical Strength: ≥3000MPa
- Low cost
- Not affected by humidity and dust
- No antennae effect
Technical Parameters:
| Surface Roughness | 0.3-0.8 Um |
| Insulation Strength | >=15KV/mm |
| Durability | Long-lasting |
| Material | Ceramic, SiC, Al₂O₃, SiO₂, Al₄C₃ |
| Density | 3.7g/cm³ |
| Thermal Conductivity | 9-180 MW/m.K |
| Color | Green, Black, White, Gray |
| Mechanical Strength | >=3000MPa |
| Heat Dissipation | Efficient |
| Size | Various Sizes Available |
| Adhesive Tape | With and without thermally conductive Silicone adhesive tape |
| EMI Issues | No Electromagnetic Interference (EMI) issues |
| Antennae Effect | No antennae effect |
Applications:
The Ceramic Heat Sink/Ceramic Micro Porous Heat Sink has a large
surface area compared to Aluminium Heat Sinks, resulting in better
heat dissipation. Its lightweight design makes it easy to install
and handle. With a temperature resistance of less than 700℃ and a
density of 3.7g/cm^3, this product is ideal for applications that
require high-temperature resistance and high-density power.
This product can be used with various electronic devices such as
Transistors, MOSFETs, Schottky Diodes, IGBTs, high-density
switching power supplies, high-frequency communication signal
equipment, high-frequency welding machines, and other electronic
devices. Its power dissipation of up to 10W makes it suitable for
high-performance applications.
At Race, we offer packaging options as per customer requirements
and a delivery time of 7-15 days. Payment terms are 30% TT in
advance, and the balance payment is paid before shipment. The
Ceramic Heat Sink/Ceramic Micro Porous Heat Sink is available in
green, black, white, and gray colors, giving our customers the
opportunity to choose the color that best suits their device.
