Product Description:
In the pursuit of efficient heat dissipation solutions, our ceramic
heat sink stands out and becomes the ideal choice for numerous
industries. This meticulously crafted heat sink combines advanced
material technology and innovative design to provide your equipment
with excellent heat dissipation performance.
Exceptional Ceramic Material
Our heat sink is made of high - quality ceramic material. This
material has an extremely high thermal conductivity, which can
quickly conduct heat away from the heat source. Compared with
traditional metal heat sinks, ceramic heat sinks are not inferior
in terms of thermal conductivity efficiency. Even under certain
specific working conditions, they perform more outstandingly. At
the same time, ceramic materials have excellent high - temperature
resistance. Even when working in a high - temperature environment
for a long time, they can still maintain stable physical and
chemical properties. They will not deform or age due to excessive
temperature, ensuring the long - term reliability of the heat sink.
Efficient Heat Dissipation Structure Design
The unique fin structure is a major highlight of this ceramic heat
sink. The carefully designed fin shape and arrangement greatly
increase the contact area between the heat sink and the air,
promoting the rapid dissipation of heat. Through the optimized air
duct design, air can flow smoothly through the fins, taking away
heat and forming efficient convective heat dissipation. In
addition, the overall structure of the heat sink is compact,
achieving maximum heat dissipation in a limited space, which is
very suitable for application scenarios with strict space
requirements.
Wide Range of Application Fields
With its excellent performance, this ceramic heat sink shows strong
applicability in multiple fields. In the field of electronic
devices, such as the heat dissipation of computer CPUs and GPUs, it
can effectively reduce the chip temperature, improve the operating
stability and performance of the device, and extend the service
life of the device. In the automotive electronic system, it can be
used for the heat dissipation of components such as engine control
units and power modules, ensuring the reliable operation of
automotive electronic devices under complex working conditions. In
the LED lighting field, it can quickly dissipate the heat generated
by LED chips, improve the luminous efficiency and lifespan of LED
lights, and reduce the phenomenon of light decay.
Quality and Reliability Assurance
We strictly control product quality. Every link from raw material
procurement to production and processing follows international
standards and strict quality inspection procedures. Each ceramic
heat sink has undergone strict performance tests before leaving the
factory to ensure that its heat dissipation performance, structural
strength and other indicators meet high - quality requirements.
Choosing our ceramic heat sink means choosing a reliable heat
dissipation solution to escort the stable operation of your
equipment.
If you are looking for a high - performance and highly reliable
heat dissipation product, our ceramic heat sink is undoubtedly your
best choice. It will create a cool and stable operating environment
for your equipment with its excellent heat dissipation performance.
Features:
- Product Name: Ceramic Heat Sink
- Temperature Resistance: ＜700℃
- Surface Roughness: 0.3-0.8 Um
- Density: 3.7g/cm^3
- Material: Ceramic, SiC, Al₂O₃, SiO₂, Al₄C₃
- Mechanical Strength: ≥3000MPa
- Low cost
- Not affected by humidity and dust
- No antennae effect
Technical Parameters:
| Surface Roughness | 0.3-0.8 Um |
| Insulation Strength | >=15KV/mm |
| Durability | Long-lasting |
| Material | Ceramic, SiC, Al₂O₃, SiO₂, Al₄C₃ |
| Density | 3.7g/cm³ |
| Thermal Conductivity | 9-180 MW/m.K |
| Color | Green, Black, White, Gray |
| Mechanical Strength | >=3000MPa |
| Heat Dissipation | Efficient |
| Size | Various Sizes Available |
| Adhesive Tape | With and without thermally conductive Silicone adhesive tape |
| EMI Issues | No Electromagnetic Interference (EMI) issues |
| Antennae Effect | No antennae effect |
Applications:
The Ceramic Heat Sink/Ceramic Micro Porous Heat Sink has a large
surface area compared to Aluminium Heat Sinks, resulting in better
heat dissipation. Its lightweight design makes it easy to install
and handle. With a temperature resistance of less than 700℃ and a
density of 3.7g/cm^3, this product is ideal for applications that
require high-temperature resistance and high-density power.
This product can be used with various electronic devices such as
Transistors, MOSFETs, Schottky Diodes, IGBTs, high-density
switching power supplies, high-frequency communication signal
equipment, high-frequency welding machines, and other electronic
devices. Its power dissipation of up to 10W makes it suitable for
high-performance applications.
At Race, we offer packaging options as per customer requirements
and a delivery time of 7-15 days. Payment terms are 30% TT in
advance, and the balance payment is paid before shipment. The
Ceramic Heat Sink/Ceramic Micro Porous Heat Sink is available in
green, black, white, and gray colors, giving our customers the
opportunity to choose the color that best suits their device.
