TIF®050-11 Thermal Conductive Gel Gray 5.0W Single Component For Power
Module Base
Prodcuts Discription
TIF®050-11 is a soft silicone gel-based gap filler pad, formulated with
aspecial blend of fillers to provide both excellent thermal
conductivity and superior softness. Compared to conventional
thermal greases, TIF®050-11 has a high erviscosity, which
effectively prevents filler separation from the silicone matrix and
reduces filler migration, helping maintain consistent thermal
performance. It is applied in a similar manner to thermal grease
and is suitable for commercial dispensing or automated equipment.
Typical applications include flip-chip microprocesors, PPGAs, micro
BGA packages, BGA packages, DSP chips, circular silicon chips,LED
lighting, and other high-power electronic components.
Feature
> Thermal conductivity: 5.0W/mK
> Soft, very low compression
> Low thermal inpedance
> Operate automaticly
> Proven long-term reliability
Application
> Heat-sink & frame
> LED backlight module, LED lighting
> High speed hardware driver
> Micro heat pipe
> Vihicel enginee controller
> Telecom industry
> Semiconductor automatic laboratory equipment
| TIF®050-11 Typical Properties |
| Property | Value | Test method |
| Color | Gray | Visual |
| Construction & Composition | Ceramic filled silicon material | - |
| Flow Rate(g/min) | 40 | Ziitek Test Method (30 cc syringe/ 2.5 mm orifice/ 90 psi) |
|
| Density(g/cc) | 3.20g/c | ASTM D297 |
| Thermal conductivity | 5.0W/mK | ASTM D5470 |
| Thermal Impedance @10psi (℃.in²w) | 0.077 | ASTM D5470 |
| Thermal Impedance @50psi (℃.in²w) | 0.068 | ASTM D5470 |
| Recommended Operating Temp | -45 ~200°C | Ziitek Test Method |
| Dielectric Strength(V/mm) | ≥4000 | ASTM D149 |
| Bond Line Thickness(mm) | 0.2 | Ziitek Test Mothod |
| Flame Rating | V-0 | UL 94 |
| Shelf Life | 12 months | - |
Packing details
30 cc/pc, 98 pc/box;
300 cc/pc , 6 pc/box
We offer the custom packaged in syringes for automated despensing
applications.
Please contact us for confirming.
Company Profile
Ziitek company is a manufacturer of thermal conductive gap fillers, low melting
point thermal interface materials, thermal conductive insulators,
thermally conductive tapes, electrically & thermally conductive
Interface pads and thermal grease,Thermal Conductive
plastic,Silicone Rubber,Silicone Foams,Phase Changing Materials
products, with well-equipped testing equipment and strong technical
force.
Q&A
Q: Are you trading company or manufacturer ?
A: We are manufacturer in Vietnam.
Q: How long is your delivery time?
A: Generally it is 3-7 work days if the goods are in stock. or it
is 7-10 work days if the goods are not in stock, it is according to
quantity.
Q: Do you provide samples ? is it free or extra cost?
A: Yes, we could offer samples free of charge.
