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Mold forming epoxy resin APG injection process high temperature curing adhesive

    Buy cheap Mold forming epoxy resin APG injection process high temperature curing adhesive from wholesalers
     
    Buy cheap Mold forming epoxy resin APG injection process high temperature curing adhesive from wholesalers
    • Buy cheap Mold forming epoxy resin APG injection process high temperature curing adhesive from wholesalers
    • Buy cheap Mold forming epoxy resin APG injection process high temperature curing adhesive from wholesalers
    • Buy cheap Mold forming epoxy resin APG injection process high temperature curing adhesive from wholesalers

    Mold forming epoxy resin APG injection process high temperature curing adhesive

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    Brand Name : wenyou
    Model Number : 8316L
    Certification : ISO9001, ISO14001, SGS, and UL
    Price : Negotiable
    Payment Terms : Normally T/T, L/C
    Supply Ability : Plenty of raw material in stock
    Delivery Time : 7 -10 work days
    • Product Details
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    Mold forming epoxy resin APG injection process high temperature curing adhesive

    Brief Introduction

    LE-8316L is a modified BPA-type epoxy resin, combined with LH-8316L, a liquid modified carboxylic anhydride hardener. This system is designed for mold forming and APG injection processes, providing high-temperature curing capabilities.

    Applications

    This epoxy resin is ideal for low-voltage electrical applications, including electronics, cable insulation, bonding, and sealing. It is particularly suited for sealing and connecting insulation products, as well as current and voltage transformers.

    Processing Methods

    Processing can be carried out using a conventional gravity casting method under vacuum conditions. The production process can also be tailored to align with the client's existing manufacturing techniques.

    Properties

    This two-component epoxy resin system consists of LE-8316L and LH-8316L, both in liquid form at room temperature. It is suitable for casting processes, with a glass transition temperature (Tg) ranging between 60-80°C, ensuring durability under elevated temperatures.

    Formulation


    Epoxy resinLE-8316L100 pbw
    HardenerLH-8316L100 pbw
    FillerSilica powder300 - 400 pbw
    Color pasteLC series *Appropriate pbw

    Advantage



    Package Image


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    Example application image



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