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0 25mm Finished Bga Package Substrate

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0 25mm finished bga package substrate

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ENIG Wire/die Bond BGA package Substrate IC Packaging Substrate fabrication

Application:IC substrate package,Wifi module/Bluetooth module,Memory package,Memory packaging substrate,Dram/SSD/LPDDR package substrate,IC package,Semiconductor package,Memory electronics,NAND/Flash memory; Spec.of substrate production: Mini.Line space/......

HongRuiXing (Hubei) Electronics Co.,Ltd.

Address: Tianyue building 711,518100 shajing centre bao'an district Shenzhen city

TG140 HDI Half Hole PCB 4 Layer FR4 Substrate 100 Ohm

...Substrate Board Info: 1 Part NO: Half hole PCB0013 2 Layer Count: 4 Layer PCB 3 Finished Board Thickness: 0.8 MM tolerance is +/-0.1MM 4 Solder Mask: Green 5 Min Lind Space&Width: 6/6 mil 6 Application Area: Blue-tooth Module 7 Drillings: L1-L4 0.2MM Mechanical Drilling 8 BGA Size: 0.25MM......

Witgain Technology Limited

Address: Room 1520, Block 11, International E-Commerce Logistics Center, PingAn Road, PingHu Street, LongGang District, ShenZhen City, China 518111

64 Feeders 6 Head Placement 500W PCB SMD Assembly Machine

... substrate and strip lights. The finished products can be used in producing resistor-capacitor, glass cylinder package diode, triode, TQFP package, QFN package, QFP package, BGA package, lamp pole etc. Technical parameters Maximum mounting ......

Beijing Silk Road Enterprise Management Services Co.,LTD

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To: HongRuiXing (Hubei) Electronics Co.,Ltd.
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Your subject must be between 10-255 characters!
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For the best results, we recommend including the following details: --Self introduction --Required specifications --Inquire about price/MOQ Your message must be between 20-3,000
Yes! I would like your verified suppliers matching service!

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