Mass Storage Devices Applicated TIF5140-50-11S 3.5mm CPU Thermal Pad 5.0W/M-K
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... 5.0W/M-K soft pad 45shore00 Company Profile With professional R&D capabilities and over 13 year experiences in thermal interface material industry, Ziitek company own many unique formulations which are our core technologies and advantages. Our goal is to...
Dongguan Ziitek Electronical Material and Technology Ltd.
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TIF100-30-11US Thermal Conductivity 1.5W Thickness 0.5~5.0mm Silicone Thermal Pad Insulation Thermal Pad For Game Machine
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TIF®100-30-11US Thermal Conductivity 1.5W Thickness 0.5~5.0mm Silicone Thermal Pad Insulation Thermal Pad For Game Machine Product descriptions TlF®100-30-11US Series thermally conductive interface materials are applied to fill the air gaps between the ......
CÔNG TY TNHH CÔNG NGHỆ ZIITEK VIỆT NAM
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Cpu Thermal Pad 4.0W/MK With 45 Shore 00 Hardness For RDRAM Memory Modules
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Cpu Thermal Pad 4.0W/MK With 45 Shore 00 Hardness For RDRAM Memory Modules The TIF100-40-11S Series is recommended for applications that require a minimum amount of pressure on components. The viscoelastic nature of the material also gives excellent low-stress vibration dampening and shock absorbing characteristics. Thermally......
Dongguan Ziitek Electronic Materials & Technology Ltd.
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Multiscene CPU Thermal Pad Material Weather Resistant Pink Color
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...Thermal Conductivity Pink Thermal Pad Silicone Material For CPU Attribute Value Test Method Composition Ceramic Filler + Silicone - Color Pink Visual Thickness(mm) 0.5~10 astm d374 Density(g/cc) 3.35 ASTM D792 Hardness(shore oo) 55±10 ASTM D2240 Usage Temperature(℃) -40~150 -- Electrical Breakdown Voltage(kv/mm) ＞6.0 ASTM D149 Dielectric Constant(@10mhz) 7.2 ASTM D150 Volume Resistivity(Ω.cm) 1012 ASTM D257 Flammability V-0 UL94 Thermal...
Shenzhen Aochuan Technology Co., Ltd
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High Volume Resistivity Custom CPU Thermal Pad with Options Density 3.0±0.5 G/cm3
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Product Description: With an operating temperature range of -40°C to 200°C, this Silicone Thermal Pad can easily handle extreme temperatures, making it a perfect choice for use in high-temperature applications. Its continuous use temperature range of -40......
Shenzhen Antac Technology Limited
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Coated Paper Hang Tab Box Packaging For Silicone CPU Thermal Pads SIM CARD
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Shenzhen Senwi Printing & Packaging Co., Ltd.
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Bergquist Gap Pad 3500ULM 3.5W/M-K CPU Thermally Conductive Pad
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... thermal conductive material for soft gap filling. Product Features : Highly conformal. High thermal conductivity. Low modulus. Non-fiberglass options for applications requiring further stress reduction. Glass fiber reinforced to improve workability and...
SZ PUFENG PACKING MATERIAL LIMITED
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Best Quality High Thermal Conductivity GPU CPU Thermal Gap Pads
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...Thermal Conductivity GPU CPU Thermal Gap Pads Thermal pads are a type of thermal interface material (TIM) that are used to improve the heat transfer between a heat source and a heat sink. They are typically made of a flexible material such as silicone, which can be easily cut or trimmed to fit a wide range of applications. Thermal pads serve the same purpose as every other form of thermal......
Trumony Aluminum Limited
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3W/MK Soft Silicone Thermal Pad Insulating Sheet for Computer CPU GPU Chip Heat Sink Heatsink Cooling Thermal Conductive Pad
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Product Description: Our Thermal Conductive Silicone Pad is made of silicone, a durable material that can withstand high temperatures and harsh environmental conditions. With a hardness of 45 ShoreC and a tensile strength of 3 MPa, this Thermal Heat Sink ......
Shenzhen Linmao Electronic Material Co.,Ltd.
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Ceramic Insulation Thermal Pads 4mm Alumina Oxide Ceramic Plate
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AL2O3 Alumina Ceramic Plate Ceramic Insulation Thermal Pads Alumina Oxide Ceramic Plate Alumina oxide ceramic plate has a high thermal conductivity : 24w/m.k, 0.635mm, 1.0mm, 2.0mm, 3.0mm, 4.0mm can be offered for TO-220, TO-247, TO-264, TO-3P sizes, ......
Dongguan Ming Rui Ceramic Technology Co.,ltd
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