Highly Efficient Thermal Conductivity 1.2W/MK Silicone Thermal Pads For Laptop Heat Insulation Materials
|
... in 2006. Is a high-tech enterprise specializing in the research, development, production and sales of thermal interface materials. We mainly produce: heat-conducting joint filler, low melting point thermal interface materials, heat-conducting insulator,...
Dongguan Ziitek Electronical Material and Technology Ltd.
|
TIF100-30-11U Highly Efficient Thermal Conductivity 1.2W/MK Silicone Thermal Pads For Laptop Heat Insulation Materials
|
TIF100-30-11U Highly Efficient Thermal Conductivity 1.2W/MK Silicone Thermal Pads For Laptop Heat Insulation Materials Product descriptions TlF®100-30-11U thermally conductive interface materials are applied to fill the air gaps between the heating ......
CÔNG TY TNHH CÔNG NGHỆ ZIITEK VIỆT NAM
|
2W/MK Heatsink Thermal Pads GPU CPU Heatsink Cooling Conductive Silicone Thermal Pad Accessories Supplies
|
2W/MK Heatsink Thermal Pads GPU CPU Heatsink Cooling Conductive Silicone Thermal Pad Accessories Supplies The TIF100-20-10E Series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat ......
Dongguan Ziitek Electronic Materials & Technology Ltd.
|
1W/Mk-10W/Mk Silicon Thermal Pad
|
Customized high temperature silicone rubber sheet thin silicone rubber sheet LED Thermal Pad LED thermal pad is a high performance thermal conductive gap filling material, mainly used for thermal interface between electronic components and heat sink or ......
SZ PUFENG PACKING MATERIAL LIMITED
|
3.0 W/mK Silicone Thermal Pads for Efficient Heat Dissipation
|
Product Description: This Thermal Heat Sink Pad is designed to provide effective thermal conductivity and insulation. It is made with high-quality silicone material, which is known for its excellent resistance to heat, cold, and other environmental factors......
Shenzhen Linmao Electronic Material Co.,Ltd.
|
Thermally Conductive Material , Electrically And Thermally Conductive Interface Pad Thermal Sheet
|
... and thermal transfer are desired. Its unique grain-oriented, plate-like structure provides a high thermal conductivity of 240 W/mK in the XY plane and 5 W/mK through the z-axis.. A-gaphite 800 can be supplied in 12” x 18” (305mm x 457mm) or 18”...
Adcol Electronics (Guangzhou) Co., Ltd.
|
0116 Silicone Thermal Grease 3.2W/M·K Gap Filler For CPU, IGBT, large storage devices, automotive electronics etc.
|
0116 TDS-EN.pdf Product Description Silicone thermally conductive compound White paste Non-curing type Product Features Thermal conductivity: 3.2 W/ m·K Solvent-free, metal powder-free for insulation requirements Very small interface thickness and very low......
Shanghai Huitian New Material Co., Ltd
|
High Thermally Conductive Interface Pads Gap Filler Thermal Pad Electronics
|
... versus deflection characteristics. The combination will allow minimal stress on components while also yielding low thermal resistance. As a result, less mechanical and thermal stresses will be experienced within your device. Tflex HD90000 is available in...
ZSUN CHIPS CO., LTD
|
2.9g/CC CPU GPU Silicone Free Thermal Pad Heatproof Weather Resistant
|
...±5 ASTM D2240 Usage Temperature(℃) -40~150 -- Electrical Breakdown Voltage(kv/mm) ≥6.0 ASTM D149 Flammability V-1 UL94 Thermal Thermal conductivity(W/m.K) 2.0 ASTM D5470 Product feature ■ Thermal conductivity: 2.0,3...
Shenzhen Aochuan Technology Co., Ltd
|
High Temperature Silicone Thermal Pad 0.23MPa Tensile Strength For Industrial
|
Product Description: The Heat Sink Thermal Pad is available in various thicknesses ranging from 0.3mm to 15mm, making it suitable for use in a wide range of applications, including computers, LED lighting, power supplies, and other electronic devices. With......
Shenzhen Antac Technology Limited
|