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2 2 G Cc Thermally Adhesive Tape

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2 2 g cc thermally adhesive tape

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0.5mm High Dielectric Strength 2.2 g/cc Thermally Adhesive Tape For Heatsink Cooling 0.9 W/mK

The TIA™810 Series products are mostly used for bonding heat dissipation fins, microprocessors and other power consumption semiconductors. This type of adhesive tape possesses ultimate bonding strength with low thermal impedance, with which in effect can ......

Dongguan Ziitek Electronic Materials & Technology Ltd.

Address: No.12 Xiju Road,, Hengli Township, 523460 Dongguan City

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