high cost-effective 2.6W/MK CPU Thermal Pad the TIF540US Outstanding thermal performance For mainboard/mother board
|
...6W/MK CPU Thermal Pad the TIF540US Outstanding thermal performance For mainboard/mother board Company Profile With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks......
Dongguan Ziitek Electronical Material and Technology Ltd.
|
TIF500 Thermal Pad 2.6W/MK Silicon Thermal Gap Pad Filling For Auditioning Electronic Products
|
...Thermal Pad 2.6W/MK Silicon Thermal Gap Pad Filling For Auditioning Electronic Products Product descriptions TlF®500 series is an extremely soft gap filling material rated at a thermal conductivity of 2.6W/m-K. It is specially formulated for high performance applications requiring low assembly stress. The material offers exceptional thermal......
CÔNG TY TNHH CÔNG NGHỆ ZIITEK VIỆT NAM
|
High Temp Resistance 2.6W/MK Soft Silicone Type Thermal Pad For Electronics
|
...6W/MK Soft Silicone Type Thermal Pad For Electronics Products Description TIFTM580BS use a special process, with silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink. Features: > Good thermal conductive : 2.6W/mK......
Dongguan Ziitek Electronic Materials & Technology Ltd.
|
3W/m·K 0.3~10mm High Thermal Conductivity Electronic Components Heat Conducting Fin
|
3W/m·K high thermal conductivity electronic components heat conduction plate Product features/Applications: High cost performance, high thermal conductivity, low thermal resistance. High adherence, soft and elastic, easy to install, can be repeatedly ......
SZ PUFENG PACKING MATERIAL LIMITED
|
Submit your “2 6w mk notebook thermal pad” inquiry in a minute :