1.2W/Mk Thermal Gap Filler Pad Multi Size Silicone Pad High-Temperature CPU Graphics Card Heat Dissipation Insulation Pad
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... to developing composite thermal solution and manufacturing superior thermal interface materials for competitive market. Our vast experience allows us to assist our customers best in thermal engineering field.We serve customers with customized products,...
Dongguan Ziitek Electronical Material and Technology Ltd.
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TIF100C 6530-11 Excellent Thermal Conductivity 6.5W/MK Thermal Gap Filler Pad For CPU And GPU Processors
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...Thermal Conductivity 8.0W/MK Thermal Gap Filler Pad For CPU And GPU Processors Product descriptions TS-TIF®100C 6530-11 series is a silicone-based thermal material designed to fill the gaps between heat-generating components and liquid cooling plates or metal bases.lts flexibility and elasticity make it ideal for covering highly uneven surfaces.With excellent thermal......
CÔNG TY TNHH CÔNG NGHỆ ZIITEK VIỆT NAM
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2.8W / MK Conductivity Thermal Gap Filler Pad For PCB Board Applicated
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...MK Conductivity Thermal Gap Filler Pad For PCB Board Applicated The TIF3160 thermal silicone pad is a product with both performance and economy. It is a unique thermal pad with low oil permeability, low thermal resistance, high softness and high compliance.It can work stably at -40℃~160℃ and meet the requirement of UL94V0. Features: > Perfect heat sinking > Good thermal conductive: 2.8 W/mK......
Dongguan Ziitek Electronic Materials & Technology Ltd.
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Grey Thermal Gap Filler Pad Material Silicone Based Thermal Conductivity
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...Thermal Gap Filler Thermal Pad Laird Thermal Conductivity 7.5W/Mk Grey High Deflection Product Description Laird’s Tflex™ HD7.5 gap filler is a new developed very soft silicone material in our high deflection series. With a thermal conductivity of 7.5W/ mk......
ZSUN CHIPS CO., LTD
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1.4W/M.K LED Thermal Interface Pad , Conductive Thermal Gap Filler Pad Reusable
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... interface between electronic components and heat sink or product outer covering. Specifications: 1. Thermal conductivity 1.0 W/M.K~6.0W/M.K 2. Thickness 0.2-20mm 3. Customized 4. Easy to install APPLICATION * Communication equipment * LED lighting *...
SZ PUFENG PACKING MATERIAL LIMITED
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2 W / M * K Thermal Gap Filler Pads For Lithium Battery Pack Cooling Plate
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...Thermal Gap Filler Pads For Lithium Battery Pack Cooling Plate Discription of Thermal Gap Filler Pads: Thermal Gap Filler Pads is generally located between the liquid cooling plate and the cell pole, which can effectively exclude air and achieve good filling and Thermal Gap Filler Pads effects. In addition, it also has good insulation and voltage resistance characteristics and temperature stability, safe and reliable use. Thermal Gap...
Trumony Aluminum Limited
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Ultrasoft Thermal Gap Filler Pads , Thickness 0.5 mm Heat Sink Rubber Pads
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0.5 mm Thickness Pink Low Volume Resistivity Silicone Thermal Pad Material Attribute Value Test Method Composition Ceramic Filler + Silicone -- Color Pink Visual Thickness(mm) 0.5~10 astm d374 Density(g/cc) 3.35 ASTM D792 Hardness(shore oo) 55±10 ASTM ......
Shenzhen Aochuan Technology Co., Ltd
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Thermal Insulation Battery Interface Thermal Gap Filler Pad Flame Retardant
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Battery Thermal Management System Thermal interface gap pads flame retardant properties good thermal insulation Description It is a thermal insulation structural part product. It has the characteristics of high heat preservation, high flame retardancy and ......
Fuzhou Fuqiang Precision Co., Ltd.
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Thermal Gap Filler Thermal Conductive Material Thermal Pad 30 seconds Hardness
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... of 3 W/mK. These outstanding properties are the result of a proprietary boron nitride filler in the composition. The high conductivity, in combination with extreme softness produces incredibly low thermal resistances. A-gapfill 600 is naturally tacky and...
Adcol Electronics (Guangzhou) Co., Ltd.
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Dowsil TC-4525 Thermally Conductive Gap Filler 2.5W/m·K for Automotive
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Dowsil TC-4525 Thermally Conductive Gap Filler for Automotive Electronics Cooling Product Attributes Dowsil TC-4525 is a two-part, room temperature cure silicone gap filler with thermal conductivity of 2.5 W/m·K, low compression stress, and controlled ......
Shenzhen Huazhisheng New Material Technology Co., Ltd.
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