2W / MK Cooling Thermal Conductive Silicone Adhesive Gap Insulation Pad
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... compliancy. This product has low hardness is conformable and is electrically isolating. The low modulus characteristic of the product offers optimal thermal performance with the ease of handling Features: Good thermal conductive 2 W/mK Moldability for...
Dongguan Ziitek Electronic Materials & Technology Ltd.
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3.0 W/mK Thermal Conductivity Silicone Pad for Power Electronics Cooling
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Product Description: This Thermal Conductive Silicone Pad has a Tensile Strength of 3 MPa and an Elongation of 100%, making it strong and durable. It can withstand high temperatures, making it suitable for use in a wide range of industries, including ......
Shenzhen Linmao Electronic Material Co.,Ltd.
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1.5W/MK Thermal Conductive Silicone Pad High Voltage GPU CPU Heatsink Cooling Insulation
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... powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink. Features > Good thermal conductive > Moldability for complex parts...
Dongguan Ziitek Electronical Material and Technology Ltd.
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TIF700Q Factory Price Hot Selling Thermal Conductive Silicon Pad 8W/MK Silicone Thermal Gap Filling
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..., to fill gaps, complete the heat transfer between heating and cooling parts, but also played insulation, damping, sealing and so on, to meet the equipment miniaturization and ultra-thin design Requirements, which is a highly technology and use, and the...
CÔNG TY TNHH CÔNG NGHỆ ZIITEK VIỆT NAM
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White 10W/Mk Heat Sink Pad For Laptop , 0.25mm Thermal Heat Transfer Pads
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Silicone Thermal Conductive Electric Cooling Pad And Laptop Cooling Pad LED Thermal Pad LED thermal pad is a high performance thermal conductive gap filling material, mainly used for thermal interface between electronic components and heat sink or product ......
SZ PUFENG PACKING MATERIAL LIMITED
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TIM Thermal Interface Materials Electronics Thermal Phase Change Material ROHS
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.... With a thermal conductivity of 7.5 W/mK, Tpcm™ 7000 is designed to enhance the cooling of the most rigorous thermal challenges in electronics. Softening between 50°C – 70°C, the initial pad thickness can decrease to a bondline as thin as 35µm...
ZSUN CHIPS CO., LTD
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