BT ENEPIG 4 Layer Sip Package Substrate 0.24mm Finished Thickness
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...Sip package substrate,Semiconductor package; Spec.of substrate production: Mini.Line space/width:1mil (25um) Finished thickness:BT (0.1-0.4mm) finished thickness; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT),mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,Neclo,Rogers,Taconic,Others; Surface finished:Mainly immersion gold,ENEPIG......
HongRuiXing (Hubei) Electronics Co.,Ltd.
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9 Pins 10 Pins Network Resistor , High Precision Sip Resistor Pack
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... process controls are used in every step of production to insure 'built-in' reliability and consistent quality. FEATURES: Small in size with high precision package It is suitably used in...
SHENZHEN JINGDACHENG ELECTRONICS CO.,LTD
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CC2652PSIPMOTR 2.4GHz Wireless System-in-Package With Integrated Power Amplifier
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... Wireless System-in-Package With Integrated Power Amplifier Product Description Of CC2652PSIPMOTR CC2652PSIPMOTR a System-in-Package (SiP) certified module, multiprotocol 2.4 GHz wireless microcontroller (MCU) supporting Thread, Zigbee®, BT® 5.2 Low ......
ShenZhen Mingjiada Electronics Co.,Ltd.
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