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Bt Fr4 Boc Pacakge Substrate

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bt fr4 boc pacakge substrate

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BT material semiconductor Pacakge Substrate L/S 35/35um

BOC pacakge substrate manufacture with short delivery time Application:Memory package,Memory packaging substrate,Dram/LPDDR/DDR package substrate,Semiconductor package; Spec.of pcb production: Mini.Line space/width 1mil (20um) Finished thickness BT (0.1-0.4mm) finished thickness Mainly brand SHENGYI,Mitsubishi(BT-FR4......

HongRuiXing (Hubei) Electronics Co.,Ltd.

Address: Tianyue building 711,518100 shajing centre bao'an district Shenzhen city

6 Layer Multilayer PCB Red Solder Mask White Silk Screen For Ultrasonic Wave

... RO4350, Rogers RO4003 Polyimide Teflon Black FR-4 Arlon AR-350 CEM-3 Getek Copper Clad Thermal Substrates Hybrid (Rogers and FR4) BT Epoxy Nelco 4013 PTFE Metal Core Materials Aluminum Core Board...

Shenzhen Xinchenger Electronic Co.,Ltd

Address: Room 403 Block A,Huafeng SOHO Creative World Hangcheng Industrial Zone Qianjin 2nd Road,Xixiang Baoan Shenzhen,China

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