Rectangular Mirror Polished DIP4 MGP Mould For Semicon Processing
|
|
DIP4 MGP Mold Technical Parameters 1. The roughness of the cavity can achieve 0.2um.max; 2. Special products can increase the design of vacuum and built -in core pumping mechanisms; 3. According to the size of different lead frames, 8 tablets/12 pieces/16 tablets per mold can be achieved. Technical Parameters: MGP Mold Technical Parameters Product Name High-Precision MGP Mold Application Semiconductor MGP Mold......
Guangdong Taijin Semiconductor Technology Co., Ltd
|
Submit your “dip4 mgp mold” inquiry in a minute :
