Gold Plated Molybdenum Wire for Semiconductor Packaging 0.01-0.4mm
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...Gold Plated Molybdenum Wire is specially designed for precision wire cutting applications and wire cutting spray systems. Manufactured with premium-grade molybdenum as the base material, this wire features a uniform and durable gold plating that ensures excellent conductivity, corrosion resistance, and enhanced durability. Ideal for industrial wire cutting spray, this molybdenum wire......
SICHUAN WINNER SPECIAL ELECTRONIC MATERIALS CO., LTD.
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wire bonding memory substrate with gold plating manufacture
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Application:IC package,Semiconductor package,Memory electronics,NAND/Flash memory; Spec.of substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.18mm; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPly,Ticer......
HongRuiXing (Hubei) Electronics Co.,Ltd.
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High Purity Planar Molybdenum Sputtering Target Plate Silver Color
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High Purity Molybdenum Planar Sputtering Targets Molybdenum Sputtering Target Description In the electronics industry molybdenum sputtering targets are mainly used for flat panel displays, electrodes and wiring materials for thin film solar cells and ......
Luoyang Hypersolid Metal Tech Co., Ltd
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