Telecommunication Hardware 3.0W/m-K Thermal Gap Fillers Materials With High Thermal Conductivity 45 shore00
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Telecommunication Hardware 3.0W/m-K Thermal Gap Fillers Materials With High Thermal Conductivity 45 shore00 The TIF100-30-02US thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation ......
Dongguan Ziitek Electronic Materials & Technology Ltd.
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Ultrasoft Odorless Conductive Silicone Pad, Heatproof Thermal Gap Filler Material
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8 W/m.K Thermal Conductivity Thermal Pad Silicone Material For Wireless Charger Attribute Value Test Method Composition Ceramic Filler + Silicone - Color Pink Visual Thickness(mm) 0.5~10 astm d374 Density(g/cc) 3.35 ASTM D792 Hardness(shore oo) 55±10 ASTM ......
Shenzhen Aochuan Technology Co., Ltd
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1.5 W/MK 12±5 Shore 00 Thermal Gap Filler Dark Gray For Memory Modules
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... product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent. TIF100-01ES-Series-Datasheet.pdf TIF120-01ES is recommended for applications that ......
Dongguan Ziitek Electronical Material and Technology Ltd.
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High Performance One Component Thermal Gap Filler for PCB CPU
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... with thermally conductive filler, stirred, mixed and encapsulated. It adopts dispensing design, when used with the glue mixing nozzle hit, easy to use and fast, can achieve automatic dispensing production. Thermally conductive gel is divided into one...
Trumony Aluminum Limited
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TIF100-18-01US Thermal Gap Filler Pad Thermal Conductive Silicone Pad For Graphics Card Thermal Module
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...applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces.Heat can ......
CÔNG TY TNHH CÔNG NGHỆ ZIITEK VIỆT NAM
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Grey Thermal Gap Filler Pad Material Silicone Based Thermal Conductivity
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...Thermal Gap Filler Thermal Pad Laird Thermal Conductivity 7.5W/Mk Grey High Deflection Product Description Laird’s Tflex™ HD7.5 gap filler is a new developed very soft silicone material in our high deflection series. With a thermal conductivity of 7.5W/ mk, Tflex™ HD7.5 is designed to provide superior pressure versus deflection characteristics. The material......
ZSUN CHIPS CO., LTD
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Thermal Gap Filler Thermal Conductive Material Thermal Pad 30 seconds Hardness
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... of 3 W/mK. These outstanding properties are the result of a proprietary boron nitride filler in the composition. The high conductivity, in combination with extreme softness produces incredibly low thermal resistances. A-gapfill 600 is naturally tacky and...
Adcol Electronics (Guangzhou) Co., Ltd.
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1.4W/M.K LED Thermal Interface Pad , Conductive Thermal Gap Filler Pad Reusable
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... interface between electronic components and heat sink or product outer covering. Specifications: 1. Thermal conductivity 1.0 W/M.K~6.0W/M.K 2. Thickness 0.2-20mm 3. Customized 4. Easy to install APPLICATION * Communication equipment * LED lighting *...
SZ PUFENG PACKING MATERIAL LIMITED
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Low Density Thermally Conductive Gap Filler Dowsil TC5515LT
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...thermally conductive silicone gap filler designed for efficient heat dissipation in electronic devices and electric vehicle (EV) modules. With a thermal conductivity of 2.0 W/m·K and a cured specific gravity of 1.95, this material offers a reliable solution for thermal......
Shenzhen Huazhisheng New Material Technology Co., Ltd.
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0112 Silicone Thermal Grease 1.6W/M·K Eco-Friendly Odorless Gap Filler For CPU Or LED Chip Thermal Conductivity
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0112 TDS-EN.pdf 0112 is a one-component Silicone Thermal Conductive Grease suitable for gap filler and reducing the temperature of electronic components. Product Features: One-component, white; Physical form: paste; Wide working temperature range; Nontoxic......
Shanghai Huitian New Material Co., Ltd
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