Tablets Multiscene Silicone Heat Sink Compound For Electronics Anticorrosive
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... - Color White Visual Density(g/cc) 2.8 ASTM D792 Usage Temperature(℃) -40~150 -- Thermal Thermal conductivity(W/m.K) 1.0 ASTM D5470 Thermal Resistance(℃-in2/W)0.1mm@50psi) 0.15 ASTM D5470 Product feature ■ Thermal conductivity: 1.0~5.0W/m.K ■ No...
Shenzhen Aochuan Technology Co., Ltd
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-40℃ to +130℃ Potting Coils Epoxy Thermally Conductive Glue , Excellent Insulation Heat Conducting Glue 2.5 W/m-K
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...fire resistant epoxy encapsulant compound. It is design for potting of capacitors and electrical devices. Features > Good thermal conductive: 2.5W/mK > Excellent insulation and smoothly sourface. > Low shrinkage > Low viscosity, expediting air releaseed. >...
Dongguan Ziitek Electronic Materials & Technology Ltd.
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High Impact Conductive Compounds POM ABS Plastic Pellets
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High Impact Conductive ABS Compound High Gloss, High Impact, Good Flow ABS Conductive Compound *, *::before, *::after {box-sizing: border-box;}* {margin: 0;}html, body {height: 100%;}body {line-height: 1.5;-webkit-font-smoothing: ......
Dongguan Tuwe Polymer Co., Ltd
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Electrolube HTS Silicone Heat Transfer Compound Electronic Components Thermal
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...Heat Transfer Compound for Electronic Components Thermal Interface Product Properties Property Value Product Type Silicone Heat Transfer Compound RoHS Compliance Yes (2015/863/EU) NATO Stock No. 5999-99-225-2132 Colour White Base Material Silicone Oil Thermo-conductive Component Powdered Metal Oxides Density @ 20°C 2.1 g/ml Cone Penetration @ 20°C 300 Viscosity @ 1rpm 201–227 Pa·s Thermal Conductivity...
Shenzhen Huazhisheng New Material Technology Co., Ltd.
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0117 4.0 W/M·K Silicone Thermally Conductive Compound Heat Transfer Medium For Electronic Components , CPU IGBT
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...EN.pdf Product Description Silicone thermally conductive compound Gray paste Non-curing type Product Features Thermal conductivity: 4.0 W/ m·K It contains metal powder to enhance thermal conductivity and non-insulating Very small interface thickness and ......
Shanghai Huitian New Material Co., Ltd
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1.6W PCBA Heat Conductive Material Copper Foil Tape 0.1mm Thickness
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... isolation performance, as well as their high heat conductivity and compatible surface characteristic. Copper foil is a diversely useful and oftern underutilized material. With its high conductivity of electricity and heat, it is versatile and used for...
Boalv New Material Technology Co., Ltd.
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LED Thermal Conductive Nylon Granules Pellets Form White Plastic Heat Conduction Material
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...Heat Conductive Plastic 1.8W For LED Light Housing TCPTM200-30-06A is a Thermally Conductive Engineering Plastic developed for the housing design which requires high thermally conductivity and reduces the weight more than 30% comparing with the same aluminium devices. TCP200-30-06A Thermally Conductive plastic.pdf Application TCP™200-30-06A can be used in applications such as Heat......
Dongguan Ziitek Electronical Material and Technology Ltd.
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SUS310 Heat Treatment Compound Balanced Mesh Belt
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...Heat Treatment Compound Balanced Mesh Belt Compound Balanced Mesh Belt Description Compound Balanced Mesh Belt Material: iron , high carbon steel , 201 stainless steel , 304 stainless steel , 316 stainless steel , 316L stainless steel , 310 stainless steel , 314 stainless steel . we can do as the material as clinets want. Compound Balanced Mesh Belt Spiral wire diameter common size : 1.2mm , 1.4mm , 1.5mm and so on . Compound......
Hebei Reking Wire Mesh Co.,Ltd
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Vocational Training Tools And Equipment Thermal Transfer Demonstrational Equipment Heat Conduction in Fluids
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...thermal resistance of fluids determination of thermal conductivities k for different fluids at different temperatures transient heat conduction in fluids: interpret transient states during heating and cooling introduction to transient heat conduction with...
Jinan Should Shine Didactic Equipment Co., Ltd.
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Thermal Conductive Compound LED Sealant
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...Conductive Compound Grease for LED Assemblies DESCRIPTION SGH233 thermal conductive grease is a paste-like thermal interface material based on siloxane polymer and thermal conductive fillers. SGH233 can fill micro voids and reduce contact resistance. It is suitable for screen printing, automatic dispensing, brushing and other processes. KEY FEATURES Good thermal conductivity......
GUANGZHOU BAIYUN TECHNOLOGY CO., LTD.
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