Wafer Bare Die Tray Packaging For Electronics Semiconductor Industry
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Wafer Bare Die Tray Packaging For Electronics Semiconductor Industry IC Packaging delivery systems for protecting and transporting bare die, CSP, ... die (KGD), chip scale packaging (CSP), and wafer scale packaging (WSP). An anti-static tray is an ideal ......
Shenzhen Hiner Technology Co., Ltd.
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Industrial SSD For Edge Computing 64GB 128GB 256GB Solid State Drive KIOXIA Wafer Good Die SSD
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Industrial SSD For Edge Computing 64GB 128GB 256GB Solid State Drive KIOXIA Wafer Good Die SSD Industrial Grade SATA 2.5'' SSD Specification Capacity 64GB / 128 / 256GB / 512GB / 1TB Interface SATA 2.5'' Protocol ......
China Chips Star Semiconductor Co., Ltd.
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AC DC Power Module / Switching Power Supply 12V 8A Switch Power Plate Bare Die
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AC-DC power module 12V switch power board high power 12V8A switch power plate bare die Introduction of functions and parameters: This power supply has over current protection, overload protection and short circuit protection, AC85~265V wide ......
Changzhou Geng Tai Electronics Co., Ltd
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High Power MOSFET PCFA86062 Power MOSFET, N-Channel, 100 V, 1.8 mΩ, Bare Die
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High Power MOSFET PCFA86062 Power MOSFET, N-Channel, 100 V, 1.8 mΩ, Bare Die [Who we are?] Sunbeam Electronics (Hong Kong) Co. Ltd is focus on semi-conductors sourcing and electronic components sale and service for clients over 10 years, specialize in ......
Sunbeam Electronics (Hong Kong) Limited
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High Performance Wafer Type Butterfly Valve DN150 Large Diameter Bare Stem Shaft
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High Performance Wafer Type Butterfly Valve DN150 Large Diameter Bare Stem Shaft Specifications Applicable Standards: * Design and Manufacturing:GB/T12238-2005 * Connection:JB/T79-94(2) * Face to Face Dimension:GB/T12221(20) * Test and Inspection:JB/T9092-......
Wenzhou Xidelong Valve Co. LTD
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SiC wafer SiC Epitaxial wafer 4H-N HPSI 6H-N 6H-P 3C-N for MOS or SBD
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...-Purity Semi-Insulating], and 6H-P type [P-type conductive]), with diameters ranging from 4-inch, 6-inch, 8-inch up to 12-inch. In addition to bare substrates, we...
SHANGHAI FAMOUS TRADE CO.,LTD
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High Precision IC Bonding Machine 8-12 Inch Wafers Die Bonders
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...Wafers General type high-precision IC bonder, which is suitable for mass wafer loading products, SIP packaging, Memory Stack Die (memory stack), CMOS, MEMS and other processes. Features: Multilayer capability Automatic nozzle change Supermini chip placement Compatible with 8-12 inch wafers Ultrathin die......
Suneast Intelligent Equipment Technology (Shenzhen) Co.Ltd
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6" Silicon Epitaxial Wafer Substrate Thickness 290±20µm / Resistivity 0.008-0.025Ωcm , Epi Layer Thickness 10-15μm
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...Wafer Substrate Thickness 290±20µm / Resistivity 0.008-0.025Ωcm , Epi Layer Thickness 10-15μm PAM-XIAMEN custom epitaxial or EPI wafer services on silicon wafers for research and development or mass production. PAM-XIAMEN processes single crystalline EPI layers on wafer diameters from 50mm to 150mm. Epitaxy is offered on bare wafers......
XIAMEN POWERWAY ADVANCED MATERIAL CO., LTD.
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Semiconductor Die Bonding Machine Packaging Equipment LED Die Attach Die Bonder
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...Die Bonder/die Bonding Machine / Die Attach Die BonderDie Bonder Suitable for: SMD HIGH-POWER COB,part COM in-line package etc. 1,Full automatic up load and down load materials. 2,Module design,max optimization structure. 3,Full intellectual property right. 4,Picking die and Bonding die dual PR system. 5,Multi-wafer ring,dual glue ect configuration. Wafer Stage System The wafer......
Shenzhen Wenzhan Electronic Technology Co., Ltd.
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ASM AD210 Plus PCB SMT Machine Automatic Die Bonding Machine
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...Die Bonding Machine ASM AD210 Plus Automatic Die Bonding System (6” wafer handling), Original and Used Die Bonding Machine Check out our best condition original and pre-owned ASM AD210 Plus Automatic Die Bonding System (6” wafer handling). Infinite Automation has a big quantity of stock for Semiconductor related equipment. Among our featured machines are original and used ASM AD210 Plus Automatic Die...
INFINITE AUTOMATION CO ., LIMITED
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