Single-piece Horizontal Wafer Packaging Box 1"-12" PP PC Wafer Transporter With Foam Cushion
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... boxes provide complete protection for 1-inch to 12-inch wafers (25mm to 300mm). Made from high-purity polypropylene (PP) or polycarbonate (PC), these containers feature custom-molded foam cushions to ensure zero wafer movement during handling. ✔ 100%...
SHANGHAI FAMOUS TRADE CO.,LTD
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8 Inch Wafer Shipping Box Black Wafer Stack Boxes Antistatic Horizontal for semiconductor chip
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...quot;, 5 ", 6 ", 8 ", and more recently 12 "or larger in diameter. The horizontal wafer box is a type of packaging that can be stacked and placed horizontally. It can protect and transport intact, thin or ultra-thin wafers better than...
Shenzhen Hiner Technology Co., Ltd.
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12”5 Nano Semiconductor Wafer Chip With EUV Technology
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...wafer can also be taken out. Each chip can take about 130 wafers, and the box is sent by air in a box of three kilograms. It can also be shipped in domestic ports. If necessary, please contact us. Taiwan channel direct hair. This is a subsidiary of our group for wafer and chip projects (uncut material, defective brand, finished product), and usable wafers......
Shenzhen Chuangying Times Technology Co., Ltd.
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4" / 100mm Single Wafer Carrier Single Wafer Sample Box For Silicon Sapphire SiC Substrate
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...Wafer Carrier, Single Wafer Sample Box for Silicon, Sapphire, SiC Substrate Cleanroom Class 100 Grade 1 inch Style Single Wafer Carrier Shipper box 6" Diameter Single Wafer Carrier Box - including Container, Cover & Spring - 4 sets/pack TCH- SP5-S6 6'' Dia159mm 156mm 155mm C-Plane TTV<3um SSP/DSP Sapphire Wafer Carriers for processing GaAs 2~4~8~10~12" Diameter Single Wafer / 25pcs Carrier Box - including Container This wafer...
SHANGHAI FAMOUS TRADE CO.,LTD
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Soi Wafer Silicon on Insulator Semiconductor Wafer
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...Wafer Silicon on Insulator Semiconductor Wafer SOI Wafer (Silicon On Insulator) * SOI Wafer sizes from 3" to 200mm, some in inventory * Very high quality with tight TTV on device layer thickness * Direct Si-Si bonding and double sided SOI available * Any Si orientation, any device thickness over 1.5um * Single and double side polished * Small lot sizes and Laser marking of wafers available * Short lead time delivery TYPES OF SOI WAFER...
Shenzhen A.N.G Technology Co., Ltd
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Semiconductor Wafers Ultrasonic Cleaning System 100KW Automated Ultrasonic Cleaner
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...Cleaning System For Semiconductor Wafers Intelligent Cleaning: The equipment adopts a fully automatic feeding and discharging cleaning mode to clean the silicon wafers. Meanwhile, the equipment is compatible with cleaning silicon wafers of various sizes......
guangdong Jietai Ultrasonic cleaning Equipment Co., Ltd.
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N Type, InAs Wafer, 2”,Prime Grade,Epi Ready-Semiconductor Wafer Manufacturing
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... wafer diameters range from 25.4 mm (1 inch) to 100 mm (6 inches) in size; wafers can be produced in various thicknesses and orientations with polished or unpolished sides and can include dopants. PAM-XIAMEN can produce wide range grades: prime ......
XIAMEN POWERWAY ADVANCED MATERIAL CO., LTD.
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Semiconductor Wafer Saw Blade Thickness 0.015 mm-0.3 mm Gallium Phosphide
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... using new electroforming technology. These blades are widely used for dicing semiconductor wafers, resistance, ceramics, semiconductor encapsulating materials and more. For more information about these super abrasive dicing blades and machining tools,...
Zhengzhou Hongtuo Superabrasive Products Co., Ltd.
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Precision CNC Components Wafer Rail 7075 Aluminum Alloy Semiconductor Wafer Transfer Guides
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...Semiconductor Wafer Transfer Guides 7075 aluminium alloy is ideally suited for the manufacture of semiconductor wafer transfer guides due to its high strength, good corrosion resistance, low density and excellent machinability. Its performance can be further enhanced by appropriate heat treatment and surface treatment to meet the stringent requirements for precision and reliability in semiconductor......
JimaFor
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Ultrasonic Semiconductor Wafer Coating Continuous
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...Semiconductor Wafer Coating Description: Wafer coating is a unique process that facilitates the automatic application of chip bonding adhesives at the wafer level, followed by the formation of chip bonding films in the next stage. FUNSONIC's ultrasonic semiconductor wafer coating technology is suitable for wafer coating, which can achieve process speed, thickness control, and material uniformity. After the hot or UVB stage and wafer...
Hangzhou Qianrong Automation Equipment Co.,Ltd
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