Bonding-Specific SiC Vacuum Chuck Wafer Adsorption Surface Flatness ≤1μm
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... component manufactured using reaction sintering or chemical vapor deposition (CVD) processes, specifically designed for semiconductor chip bonding processes. Its core function is to stably adsorb and secure wafers...
SHANGHAI FAMOUS TRADE CO.,LTD
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Solid SiC Vacuum Chuck – Ultra-Flat Carrier Plate for Thin Wafer Processing
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Introduction Of SiC Vacuum Chuck The ultra-flat ceramic wafer vacuum chuck is made with high-purity silicon carbide (SiC) coating, designed for advanced wafer handling processes. Optimized for use in MOCVD and compound semiconductor growth equipment......
SHANGHAI FAMOUS TRADE CO.,LTD
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Precision Ceramic Parts Semiconductor Wafer Chuck
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Precision Ceramic Parts Semiconductor Wafer Chuck The semiXicon porous vacuum chuck series are designed for application of handling thin films and other flexible work pieces. The chuck has uniform distributed pore sizes to assure desirable sucking and ......
HENAN ZG INDUSTRIAL PRODUCTS CO.,LTD
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