5.0W User-Friendly Thermal Insulation Silicone Thermal Gap Pad For PCB
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...Thermal Insulation Silicone Thermal Gap Pad For PCB TS-TIF®100C 5045-11 series is a silicone-based thermal material designed to fill the gaps between heat-generating components and liquid cooling plates or metal bases. lts flexibility and elasticity make it ideal for covering highly uneven surfaces. With excellent thermal conductivity, it efficiently transfers heat from heat-generating elements or PCBs......
Dongguan Ziitek Electronic Materials & Technology Ltd.
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New Type Soft And Compressible For Low Stress Applications 2.5mm Thermal Gap Pad For PCB Cooling
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... and sales of the thermal interface materials (TIMs). We have rich experiences in this field which can support you the latest, most effective and one -step thermal management solutions. We have many advanced production equipments,full test equipments and...
Dongguan Ziitek Electronical Material and Technology Ltd.
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TIF500-50-10U Thermal Pad 2W/MK Silicon Thermal Gap Pad Filling For Telecommunication Hardware
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..., to fill gaps, complete the heat transfer between heating and cooling parts, but also played insulation, damping, sealing and so on, to meet the equipment miniaturization and ultra-thin design Requirements, which is a ......
CÔNG TY TNHH CÔNG NGHỆ ZIITEK VIỆT NAM
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Best Quality High Thermal Conductivity GPU CPU Thermal Gap Pads
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...Thermal Conductivity GPU CPU Thermal Gap Pads Thermal pads are a type of thermal interface material (TIM) that are used to improve the heat transfer between a heat source and a heat sink. They are typically made of a flexible material such as silicone, which can be easily cut or trimmed to fit a wide range of applications. Thermal pads serve the same purpose as every other form of thermal......
Trumony Aluminum Limited
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Thermal Interface Material Thermal Conductive Silicone Soft Gap Pad
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...Thermal Conductive Heatsink Silicone Gap Interface Pad A-gapfill 200 is a very soft, freestanding gap filler that is more compliant than most other gap fillers. Combining good thermal conductivity of 1.1 W/mK with high conformability, this gap filler produces low thermal resistance. The alumina filler allows the product to remain a cost effective solution where moderate thermal......
Adcol Electronics (Guangzhou) Co., Ltd.
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7.3mm 2W/MK Thermal Conductive Pad For LED Lighting , Non Silicone Gap Filler Pads
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2.0W non silicone thermal interface conductive gap pad thermal gap filler LED Thermal Pad LED thermal pad is a high performance thermal conductive gap filling material, mainly used for thermal interface between electronic components and heat sink or ......
SZ PUFENG PACKING MATERIAL LIMITED
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Grey Thermal Gap Filler Pad Material Silicone Based Thermal Conductivity
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....5 Silicone Based Thermal Gap Filler Thermal Pad Laird Thermal Conductivity 7.5W/Mk Grey High Deflection Product Description Laird’s Tflex™ HD7.5 gap filler is a new developed very soft silicone material in our high deflection series. With a thermal ......
ZSUN CHIPS CO., LTD
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0111 Silicone Thermal Conductive Grease Gap Filler For CPU or LED Chip Thermal conductivity 1.2W/m·K
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...; Wideworkingtemperaturerange; Nontoxic,non-corrosive to PCB and metal; Eco-friendly, odorless; Maintain dry and flowing at high temperature; High performance on insulation, corona resistance, electric ......
Shanghai Huitian New Material Co., Ltd
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RoHS Ultrasoft Heat Sink Rubber Pads , 5W Silicone Thermal Pad For CPU GPU Heatsink
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Green Silicone High Thermal Conductive Pad With 5.0W/m.K For cpu thermal gap filler Attribute Value Test Method Composition Ceramic Filler + Silicone - Color Dark green Visual Thickness(mm) 1.0~6.0 ASTM D374 Density(g/cc) 3.2±0.1 ASTM D792 Hardness(shore ......
Shenzhen Aochuan Technology Co., Ltd
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Flexible Soft Thermal Pad Thermal Conductive Silicone Pad ISO
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...Thermal Conductivity Thermal Conductive Silicon Pad For Heat Dissipation Thermal pad is also known as thermal conductive silicone gap filler, thermal gasket, soft thermal pad and other different names. Generally speaking, thermal pad is composed of silicone gel combined with thermal conductive powder to achieve different characteristics such as thermal conductivity, insulation, and compressibility. The thermal......
Shenzhen Antac Technology Limited
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