2.54mm Thickness Ultrasoft Thermally Conductive Polymers Gap For CPU Heatsink Cooling
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2.54mm Thickness Ultrasoft Thermally Conductive Polymers Gap For CPU Heatsink Cooling The TIF100-15-07E thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base......
Dongguan Ziitek Electronic Materials & Technology Ltd.
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Thermally Conductive Material Thermal Conductive Silicone Gap Pad
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... thermal conductivity of 1.1 W/mK with high conformability, this gap filler produces low thermal resistance. The alumina filler allows the product to remain a cost effective solution where moderate thermal performance is acceptable. Naturally tacky and not...
Adcol Electronics (Guangzhou) Co., Ltd.
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TIF015AB-07S Thermal Conductive Liquid Gap Filler Silicon Gel Electreics Thermally Conductive Gel For CPU COB Computer Laptop
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... gap filling material. It is provide with two-component and different temperature curing system. The product was supplied as highly thermal conductive, soft and elastomer for coupling on electrical devices modul. Heat can transmit to the metal housing or...
CÔNG TY TNHH CÔNG NGHỆ ZIITEK VIỆT NAM
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Wholesale Heat Conductivity 0.5mm-5mm Thermal Conductive Pad Gap Filling Materials Cooling Pad For Laptop Led CPU GPU
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Wholesale Heat Conductivity 0.5mm-5mm Thermal Conductive Pad Gap Filling Materials Cooling Pad for Laptop Led CPU GPU Company Profile With professional R&D capabilities and over 18 year experiences in thermal interface material industry, Ziitek company......
Dongguan Ziitek Electronical Material and Technology Ltd.
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0111 Silicone Thermal Conductive Grease Gap Filler For CPU or LED Chip Thermal conductivity 1.2W/m·K
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0111 TDS-EN.pdf 0111 is a one-component Silicone Thermal Conductive Grease suitable for gap filling and reducing the temperature of electronic components. Product Features: One-component, white; Wideworkingtemperaturerange; Nontoxic,non-corrosive to PCB......
Shanghai Huitian New Material Co., Ltd
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Thermal Conductive Liquid Gap Filler
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...Thermal Conductivity Silicone Liquid Gap Filler With UL94V0 Flammability Attribute Value Test Method Composition Ceramic filler + Silicone - Color/Component A White Visual Color/Component B Light Bule Visual Density(g/cc) 3 ASTM D792 Usage Temperature(℃) -40~150 -- Electrical Breakdown Voltage(kv/mm) ≥7.0 ASTM D149 Dielectric Constant(@10mhz) 7.3 ASTM D150 Volume Resistivity(Ω.cm) 1.0*1013 ASTM D257 Flammability V-0 UL94 Thermal Thermal...
Shenzhen Aochuan Technology Co., Ltd
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Bergquist Gap Pad 2500S20/TGP2400 Thermal Conductive Silicone Pad
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...Gap Pad 2500S20/TGP2400 Thermal conductive silicone pad Product overview : Gap Pad 2500S20 is a glass fiber based thermal conductive material with a thermal conductivity of 2.4W/m.K. The polymer material has unusual softness and elasticity. The use of glass fiber substrate is easier to process and die cutting, and the insulation effect and tear resistance are better. Product features/Applications: Thermal conductivity......
SZ PUFENG PACKING MATERIAL LIMITED
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TIM Thermal Cycling Stability Thermally Conductive Gel for Chip
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... material compounded with thermally conductive filler. It is through a special formula and process, the polymer silicone and excellent thermal conductivity of the filler uniformly mixed, the formation of high thermal conductivity, good thixotropy and...
Trumony Aluminum Limited
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High Thermally Conductive Interface Pads Gap Filler Thermal Pad Electronics
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... versus deflection characteristics. The combination will allow minimal stress on components while also yielding low thermal resistance. As a result, less mechanical and thermal stresses will be experienced within your device. Tflex HD90000 is available in...
ZSUN CHIPS CO., LTD
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Flexible Soft Thermal Pad Thermal Conductive Silicone Pad ISO
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...Thermal Conductivity Thermal Conductive Silicon Pad For Heat Dissipation Thermal pad is also known as thermal conductive silicone gap filler, thermal gasket, soft thermal pad and other different names. Generally speaking, thermal pad is composed of silicone gel combined with thermal conductive powder to achieve different characteristics such as thermal conductivity, insulation, and compressibility. The thermal conductivity......
Shenzhen Antac Technology Limited
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