ENIG Wire/die Bond BGA package Substrate IC Packaging Substrate fabrication
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Application:IC substrate package,Wifi module/Bluetooth module,Memory package,Memory packaging substrate,Dram/SSD/LPDDR package substrate,IC package,Semiconductor package,Memory electronics,NAND/Flash memory; Spec.of substrate production: Mini.Line space/......
HongRuiXing (Hubei) Electronics Co.,Ltd.
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Communication IC Package Substrate Aluminum Base ENIG Surface Finishing
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1 layer COF communication liquid crystal driver,IC Circuit Board Product Description Product area: communication liquid crystal driver Number of layers: 1 layer COF Plate thickness: 0.12mm, Panasonic material PIGL042504-250MH, CU9/1um, Baoli oil + PI ......
Shenzhen Chaosheng Electronic Technology Co.,Ltd
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3 / 4 OZ Rolled Copper Foil , Copper Foil Paper For IC Package Substrates
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...IC Package Substrates Specifications: AvailableThickness: 12 micron-70micron Available Width: 5-520 mm Available Length: 500-5000 M Coil ID: 76 mm,152 mm Purity:99.8% Mechanical features Various kinds of Thickness and Roughness. Low profile and good peel strength with resin. Good chemical resistance. Application: IC package substrates......
JIMA Copper
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Mixed Compression Rogers 4003 C High Frequency PCB With UL ENIG Surface Finish
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...UL ENIG Surface Finish Quick Detail : 1. Type : Pcb 2. Material : Rogers+ Fr4 3. Layer : Multilayer 4. Products Size :11*5cm 5. Permittivity : 2.5 6. Surface finish : ENIG Features: FR - 4 epoxy glass fiber cloth substrate, based on epoxy resin as binder, with electronic level glass fiber cloth as reinforcing material of substrate......
Shenzhen Xinchenger Electronic Co.,Ltd
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IC Substrate Multilayer Rigid PCB for Mobile Phone EMMC Package Substrate
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Product Images About TECircuit Found: TECircuit has been operating since 2004. Location: An electronics manufacturing service(EMS) provider located in Shenzhen China. Item: Customizable EMS PCB, offers a full range of one-stop shop services. Service: ......
Shenzhen Tecircuit Electronics Limited
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UL ENIG Surface Finish Prototype 4mil SMT PCB Assembly
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SMT PCB Assembly With ENIG Surface Finish prototype pcb assembly services Company Introduction: SHINELINK Company provide full turnkey contract included Custom design, PCB prototype, PCB, PCBA, PCB Assembly, testing, accessories and cables, plastic ......
Shenzhen Shinelink Technology Ltd
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IC Packaging BGA IC Type JEDEC IC Trays Black MPPO PPE ABS PEI IDP Material
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Shenzhen Hiner Technology Co., Ltd.
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HDI circuit board FR4 TG170 substrate ENIG 2u' 10 Layer PCB
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...substrate ENIG 2u' 10 Layer PCB PCB Specifications: Part NO: S10E5012A0 Layers: 10Layer Surface Finished: Immersion gold 2u' Material: FR4 Thickness: 1.8mm PCB Size: 154mm*143mm Finished copper: 1OZ Solder Mask colour: Green Silkscreen colour: White Blind hole size: 0.127mm (1-2/9-10) Buried hole size:0.127mm (2-3/2-9/8-9) Though hole size: 0.3mm (1-10) No. of PP: 8pcs PP Certificates: UL......
Witgain Technology Limited
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Black Solder Mask IC Substrate PCB 0.2mm RoHS Compliant For Electronic Devices BT materials SD card
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...IC Substrate PCBs Green Solder Mask 0.2mm RoHS Compliant *, *::before, *::after {box-sizing: border-box;}* {margin: 0;}html, body {height: 100%;}body {line-height: 1.5;-webkit-font-smoothing: antialiased;}img, picture, video, canvas, svg {display: block;max-width: 100%;}input, button, textarea, select {font: inherit;}p, h1, h2, h3, h4, h5, h6 {overflow-wrap: break-word;}ul......
LT CIRCUIT CO.,LTD.
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Small Pcba Electronics Design ENIG Surface Finish ISO9001 ISO13485 TS16949 UL E476377
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PCB Assembly Service ENIG Surface Finish ISO9001, ISO13485, TS16949 and UL E476377 SMT Parameters: Technology Involved: Special Technology Involved ◆ IC Programming ◆ BGA rework ◆ Chip on Board/COB ◆ Eutectic soldering ◆ Auto-Gluing ◆ Conformal Coating ......
Suntek Electronics Co., Ltd.
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