8 Inch Standard Metal Wafer Dicing Ring Frame Stainless Steel for Semiconductor OEM/ODM
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.... (1) Material selection. Made of high quality stainless steel with excellent strength, corrosion and wear resistance. Stainless steel ensures that there is no contamination during the wafer dicing process. (2) Dimensions. Available in 6-inch, 8...
Shenzhen Hiner Technology Co., Ltd.
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Micro-Jet Laser Equipment for Silicon Carbide Wafer Rounding & Silicon-Based Wafer Dicing
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Abstract of microjet laser technology equipment Micro-Jet Laser Equipment for Silicon Carbide Wafer Rounding & Silicon-Based Wafer Dicing Microjet laser equipment is a kind of precision machining system that combines high energy laser and micron-scale ......
SHANGHAI FAMOUS TRADE CO.,LTD
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Silicon Paper Liner Wafer Dicing Tape for Precise Semiconductor Packaging
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... resistant polyimide material and features a tensile strength of 25N/25mm, a thickness of 0.05mm and a size of 10mm*50m. This tape is suitable for wafer dicing, UV tape release and UV adhesive applications, making it an ideal choice for all types of...
Shenzhen KHJ Technology Co., Ltd
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Revolutionize Your Optical Applications with Piezoelectric Wafer Quartz Rings
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... Wafer Quartz Rings Discover the pinnacle of sensor technology with our Piezoelectric Quartz Ring—a meticulously crafted component designed for industries demanding ultra-high precision and reliability. Engineered from single-crystal quartz, this ring ......
Hangzhou Freqcontrol Electronic Technology Ltd.
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Semiconductor Diamond Saw Blades , 0.2mm Wafer Dicing Blade
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0.2MM Thick Ultrathin Resin Bonded Diamond Dicing Blade for High Precision Cutting Super Hard Material Cutting Tools, also called Dicing Wheel or Saw Blade Sample blade specification: 58*40*0.2mm ( D * H * T) We use resin powder to increase the flexibility......
Shaanxi Tongyu Industry And Trade Co,.Ltd
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Automated Precision Dicing Machine Fully Automatic Wafer Dicing Precision Cutting
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Automated Precision Dicing Machine High-Performance Solutions for Semiconductor, Electronics, and Precision Manufacturing The Automated Precision Dicing Machine is designed for ultra-precision cutting of brittle materials such as semiconductors, ceramics......
SHANGHAI FAMOUS TRADE CO.,LTD
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Electroplated Bond Wafer Dicing Saw , Thin Type Custom Size Dicing Saw Blade
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Electroplated bond diamond blades Hub Blade with Hub HT-YB series The HT-YB series diamond abrasive blade is one specific type of electroplated hub dicing blades we supply. It is a high-end diamond cutting tool designed using advanced technology and ......
Zhengzhou Hongtuo Superabrasive Products Co., Ltd.
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10" 25" Bobcat Sweeper Brush Flat Wafer Flat Ring Sweeper Broom Brushes PP Steel Mix Wire Galvanized Iron Fastening
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Flat Style PP+Steel Mix Wire+Galvanized Iron Fastening Fit Snow/Road Sweeper Cleaning Brushes Rotary Flat Ring Brush Product Feature Application: Cleaning gutters ,Cleaning streets ,Cleaning Paring Lots ,Cleaning Runways, Cleaning Farms And so on . The ......
Anhui Uniform Trading Co.Ltd
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Plastic Wafer Dicing Potato Wedges Cutting Machine Made In China
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Certifications Product Description The vegetable cutting machine can accurately cut "slices, silk, strips" and work efficiently. The speed of the conveyor belt and the speed of the turning knife are adjusted by the frequency converter, and can be ......
Henan Huafood Machinery Technology Co.,Ltd.
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Water Industrial Manual Wafer Seat Ring Pn10 Butterfly Valve with Manual Driving Mode
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1, QX05 PVC BUTTERFLY VALVE NO. PART MATERIAL QTY PART MATERIAL QTY 1 Body PVC 1 SMALL HANDLE ABS 1 2 Seat Seal EPDM, FPM(NBR) 1 SPRING SS304, 316 1 3 Gate PVC 1 PIN SS304, 316 1 4 Stem STEEL, SS304, SS316 1 BOLT SS304, 316 1 5 O-Ring EPDM, FPM(NBR) 1 ......
Ningbo Qianxiang Huiya International Trade Co., Ltd.
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