| Sign In | Join Free | My burrillandco.com |
|
...Led Chip 2700+6000K CRI 90 US Bridgelux 3 Years Warranty Features Mechanical Dimensions: 13.35x13.35x1.9(mm) ◆Package Structure:Aluminium Base Chip on Board ◆CRI(Ra):Min.90 ◆Nominal CCT:2,700K,6,000K ◆Chroma...
...Led Chip 2700+6000K CRI 90 US Bridgelux 3 Years Warranty Features Mechanical Dimensions: 13.35x13.35x1.9(mm) ◆Package Structure:Aluminium Base Chip on Board ◆CRI(Ra):Min.90 ◆Nominal CCT:2,700K,6,000K ◆Chroma...
High Power COB LED Chip - 5-300W for Indoor/Outdoor Lighting Premium quality COB LED chips available in multiple sizes (3838, 2828, 1414, 1919) with power ranging from 5W to 300W. Ideal for various lighting app...
..., Cyan Power Source 3000W Light Source LED COB Chip Weight 22KG Usage Fishing/Boating/Camping Input Voltage AC200-265V Size Ф215*405mm Material Stainless Steel Applications: ANROFU LED Fishing Light is one o...
...Cob Chip 4050 180w Rgbwc Led Chip 21v 24v For Photography Light Rgbwc Led Chip Product Detailed Parameters Model POWER CCT LM/W IF VF WHOLE SIZE EMIT SIZE 4050 SERIES 180W 620nm/460nm/520nm/2700K /6500K 90 W...
CXA3590 Size 84W Plant Growth Light LED COB Chip High PPFD 36-39V Specification Our LEDs produce full-spectrum light. However, LEDs are better for plants, the environment, and your wallet. * LEDs are great for ...
CRI>95 Cree Size CXA1507 3W 5W 7W Bridgelux chip Australia Hot Selling LED COB Chip for Panel Light 3 Years Warranty Product Information Product Item 13.5*13.5/7.5 Chip Matrial INGAN Power 3W 5W 7W Current 3600...
CRI>95 Cree Size CXA1507 3W 5W 7W Bridgelux chip Australia Hot Selling LED COB Chip for Panel Light 3 Years Warranty Product Information Product Item 13.5*13.5/7.5 Chip Matrial INGAN Power 3W 5W 7W Current 3600...
25W-35W 19x19MM 2700-6500K Super September High Cri for LED downlight and wall lamp The form of UV LED with Key Features UVA TYPE POWER Dominant Wavelength LM/W IF WHOLE SIZE VF EMIT SIZE VIEW ANGLE 2828 SERIES...
Models LN-CAS19XW-P30-17 LN-CAS19XW-P30-17 LN-CAS19XW-P30-17 Electronic power 30W 30W 30W Color temperature WW:Warm white=2800-3200K NW:Neutral white=4000-4500K PW:Pure white=6000-7000K WW:Warm white=2800-3200K...
*, *::before, *::after {box-sizing: border-box;}* {margin: 0;}html, body {height: 100%;}body {line-height: 1.5;-webkit-font-smoothing: antialiased;}img, picture, video, canvas, svg {display: block;max-width: 10...
...Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin phosphor film layer, improve light...
...Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin phosphor film layer, improve light...
...Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin phosphor film layer, improve light...
...Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin phosphor film layer, improve light...
...Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin phosphor film layer, improve light...
...Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin phosphor film layer, improve light...
...Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin phosphor film layer, improve light...
...Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin phosphor film layer, improve light...
...Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin phosphor film layer, improve light...