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Soft and compressible Gray Compressible Thermal Conductive Silicone Pad for Memory Modules The TIF120-02S Series thermally conductive interface materials are applied to fill the air gaps between the heating ele...
Popular manufactured 1.5W/MK CPU Thermal Pad Outstanding thermal performance For RDRAM Memory Modules Company Profile Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal ...
China company supplied Good thermal conductive thermal gap pad UL recognized for Memory Modules Company Profile Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal soluti...
1.5W/Mk High Performance Thermal Gap Pad Silicone Thermal Pad For Memory Modules Company Profile Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interfa...
01984-2347-0041 is a 4MB NV Memory Module ,new original, the weight have 1.8kg . More information : If you have any questiom ,please contact me . Specifications Manuals sional can perform FFT and machine simula...
...ultra soft 2.9 G/CC CPU Thermal Pad TIF5200-30-11US 20 Shore 00 RoHS compliant For RDRAM memory modules Company Profile Ziitek Electronic Material and Technology Ltd. provides product solutions to equipment ...
1.8W/mK 20 shore00 Moldability for complex parts heat sink pad ,3.0mmT for Memory Modules The TIF5120-18-11US is not only designed to take advantage of the gap heat transfer, to fill gaps, complete the heat tra...
2.5mmT grey thermally conductive silicone rubber 27shore00 for RDRAM memory modules Company Profile Ziitek Electronic Material and Technology Ltd. is a R&D and production company, we have many production lines ...
China company supplied thermal gap filler 4w/MK Specific Gravity 3.1 g/cc for RDRAM memory modules The TIF5200-40-11US is a silicone based, thermally conductive gap pad. Its unreinforced construction allows add...
China company supplied thermal gap filler 1.2w/MK densentity 2.0 g/cm3 for RDRAM memory modules The TIF120-12-05ES is a silicone based, thermally conductive gap pad. Its unreinforced construction allows additio...
12±5 Shore00 China company supplied thermally conductive silicone rubber For Memory Modules The TIF1100-05ES thermal silicone pad is a product with both performance and economy. It is a unique thermal pad with ...
1.5 W/mK,125 Shore 00,High durability thermal gap filler, drak gray for Memory Modules Company Profile Ziitek Electronic Material and Technology Ltd. provides product solutions to equipment product which gener...
insulation and ultra soft thermal conductive gap pad 1.0mmT, 12 Shore 00 for RDRAM memory modules The TIF140-30-11ES is a highly compliant Gap Pad material that is ideal for fragile component leads. The materia...
good performance thermal gap filler TIF1100-30-11ES,3.0 W/m-K for Memory Modules The TIF1100-30-11ES use a special process, with silicone as the base material, adding thermal conductive powder and flame retarda...
Electrically isolating UL recognized TIF120-50-11US thermal pad for Memory Modules ,5.0 W/mK The TIF120-50-11US is a silicone based, thermally conductive gap pad. Its unreinforced construction allows additional...
High tack surface reduces contact resistance silicone pads for Memory Modules ,3.5mmT Company Profile With professional R&D capabilities and over 13 year experiences in thermal interface material industry, Ziit...
Outstanding thermal performance silicone pads for RDRAM memory modules ,20 Shore 00 Company Profile Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and manuf...
Outstanding thermal performance TIF1120-40-11US thermal pad for Memory Modules Company Profile Ziitek Electronic Material and Technology Ltd. provides product solutions to equipment product which generates to...
1.5mmT Blue High Durability CPU Thermal Pad for RDRAM memory modules Company Profile Ziitek Electronic Material and Technology Ltd. is a R&D and production company, we have many production lines and processing ...
1.0mmT Soft and compressible for Low Stress Applications Silicone Pads for Memory Modules The TIF140-30-02US use a special process, with silicone as the base material, adding thermal conductive powder and flame...