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...Manufacturer: SanDisk Product Category: Solid State Drives - SSD Series: PC SN730 Memory Size: 256 GB Product: NVMe SSDs Form Factor: M.2 2280 Configuration: 3D NAND Interface Type: NVMe, PCIe Minimum Operat...
...NAND flash memory is extremely dense and provides reliable performance and endurance for mass storage applications. This advanced technology is used in a variety of MLC and SLC NAND portfolios with unique fe...
...3D NAND Flash memory chip. It features a high-performance, low-power architecture with a page size of 8 KB. This chip is ideal for applications requiring high capacity storage and fast data access times. Pro...
...NAND Flash Memory implements Bit Column Stacked (BiCS) FLASH™ 3D technology. Specification Of THGAMVG8T13BAIL Part Number THGAMVG8T13BAIL Sequential Read: 400 MB/s Maximum Operating Temperature: + 85 C Moist...
Product Description Specification Part Number: Option Part Number: P37017-B21 Spare Part Number: P37074-001 General Device Type: Solid State Drive - Hot-Swap Capacity: 3.84 TB Interface: SAS 12Gbps Form Factor:...
...) for improved data reliability • Low power consumption for extended battery life • On-chip temperature sensor for improved thermal management • 3D NAND structure with...
...: - Type: Flash Memory Chips - Manufacturer: Micron - Model: MT25QU256ABA1EW9-0SIT - Technology: 3D NAND - Capacity: 256GB - Interface: SLC/QLC NAND - Operating Temperature: -40°C to +85°C - Endurance: unlim...
... ports Slots 1 SM 1 NIM 1 PIM Memory (DRAM) default 8 GB Storage (M.2 SSD) default 16 GB 1G port density 6 Storage 128 MB, NAND Number of 1G Ethernet ports 13 Number of 10G SFP+ ports 4 Number of M.2 slots 1...
... Depth 24bit Rotate Angle ± 18° Grey Levels 256 Scanning depth 2-30cm Transducer Ports 2 USB Ports 2 3D/4D module 3D/4D probe optional Hard Disc 64GB (SSD), 120G/200GB SSD (Optional) Printing Area Image, rep...
Application:Memory package,Memory packaging substrate,Dram/SSD/LPDDR package substrate,FC package substrate,FlipChip substrate,Flipchip BGA substrate;IC package,Semiconductor package,Memory electronics,NAND/Fla...
Application:Memory package,Memory packaging substrate,Dram/SSD/LPDDR package substrate;IC package,Semiconductor package,Memory electronics,NAND/Flash memory; Spec.of substrate production: Mini.Line space/width:...
... package,Wifi module/Bluetooth module,Memory package,Memory packaging substrate,Dram/SSD/LPDDR package substrate,IC package,Semiconductor package,Memory electronics,NAND/Flash memory; Spec.of substrate produ...
Application:IC substrate package,Memory package,Memory packaging substrate,Dram/SSD/LPDDR package substrate,Semiconductor package;IC package,Semiconductor package,Memory electronics,NAND/Flash memory; Spec.of s...
...,NAND/Flash memory; Spec.of substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.18mm; Material ......
... status:Stock hybrid hard drive is simply a solid-state drive (SSD) + mechanical hard drive (HDD). The core of the Toshiba hybrid drive is 1TB with 8GB SLC NAND flash, 32MB or 64MB DRAM cache, and SATA3 inte...
... status:Stock hybrid hard drive is simply a solid-state drive (SSD) + mechanical hard drive (HDD). The core of the Toshiba hybrid drive is 1TB with 8GB SLC NAND flash, 32MB or 64MB DRAM cache, and SATA3 inte...
Meeting Room Digital Media Display Writing Whiteboard 70'' IR 10 Points Touch Screen Operating System Info. CPU Celeron, i3/i5/i7 ( option) RAM 4GB ; ( option) Memory 120GB SSD ; (option) Windows OS Windows7/10...