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W25Q64JVSSIQ 8-SOIC Flash Memory Chip - High Performance Low Power Consumption Durable Storage Solution Memory Type Non-Volatile Memory Format FLASH Technology FLASH - NOR Memory Size 64Mbit Memory Organization...
S25FL127SABMFI103 Flash Memory Chips 8-SOIC Package Multi Command Set And Footprint Compatible Memory Type Non-Volatile Memory Format FLASH Technology FLASH - NOR Memory Size 128Mbit Memory Organization 16M x 8...
...Memory IC Product Description Of CY15B108QI-20LPXC CY15B108QI-20LPXC is a low-power, 8-Mbit nonvolatile memory employing an advanced ferroelectric process. Specification Of CY15B108QI-20LPXC Part Number CY15...
Memory IC Chip S70KS1282GABHA023 200MHz Pseudo SRAM Memory IC 24-FBGA Product Description Of S70KS1282GABHA023 S70KS1282GABHA023 The DRAM array appears to the host as though the memory uses static cells that r...
Memory IC Chip S70KL1283GABHV020 128Mbit Pseudo SRAM Memory IC 24-FBGA IC Chips Product Description Of S70KL1283GABHV020 S70KL1283GABHV020 is 128 Mb HYPERRAM™ self-refresh DRAM (PSRAM), 3.0 V Industrial (105°C...
...Memory IC 24-VBGA Product Description Of S27KS0642GABHM023 S27KS0642GABHM023 Memory is a high-speed, low-pin-count, low-power self-refresh Dynamic RAM (DRAM) for high-performance embedded systems requiring e...
...Memory IC MT29F2G16ABAGAWP-AAT:G Integrated Circuit Chip 2Gbit Parallel Product Description Of MT29F2G16ABAGAWP-AAT:G MT29F2G16ABAGAWP-AAT:G is NAND Flash SLC 2Gbit Parallel Memory IC, Memory Organization i...
...Memory IC Product Description Of MT29F2T08EMLEEJ4-T:E MT29F2T08EMLEEJ4-T:E is programmed and read using page-based operations and is erased using block-based operations. Specification Of MT29F2T08EMLEEJ4-T:E...
...Memory IC THGBMJG9C8LBAU8 Integrated Circuit Chip Product Description Of THGBMJG9C8LBAU8 THGBMJG9C8LBAU8 eMMC flash memory is fully compliant with the Multimedia Card Association (MMCA) high-speed memory int...
... correction code, bad block management, wear-levelling, and garbage collection. Specification Of THGBMJG7C2LBAU8 Part Number THGBMJG7C2LBAU8 Memory Size 128Gbit Memory Organization 16G x 8 Memory Interface e...
...Memory, Inc. Product Category Memory ICs Series - Packaging Tray Alternate Packaging Package-Case 60-TFBGA Operating-Temperature -40°C ~ 85°C (TA) Interface Parallel Voltage-Supply 1.7 V ~ 1.9 V Supplier-Dev...
...Memory, Inc. Product Category Memory ICs Series - Packaging Tray Alternate Packaging Package-Case 90-LFBGA Operating-Temperature 0°C ~ 70°C (TA) Interface Parallel Voltage-Supply 3 V ~ 3.6 V Supplier-Device-...
... CMOS dynamic random access memory. LPDDR4 memory is optimized to address power consumption in battery-powered applications. Compared to DDR4, its peak bandwidth is 33% faster. Compared with standard DRAM, L...
Memory IC Chip MT53E256M32D2DS-046 AAT:B 8Gbit SDRAM Mobile LPDDR4 Memory IC Product Description Of MT53E256M32D2DS-046 AAT:B MT53E256M32D2DS-046 AAT:B LPDDR4 Memory optimized to solve power consumption problem...
Memory IC Chip MT53E256M32D2DS-046 AIT:B SDRAM Mobile LPDDR4 Memory 200-WFBGA Product Description Of MT53E256M32D2DS-046 AIT:B MT53E256M32D2DS-046 AIT:B is optimized to address power consumption in battery-powe...
Memory IC Chip MT53E1G32D2NP-046 WT:B 32Gbit 2.133 GHz Mobile LPDDR4 Memory Product Description Of MT53E1G32D2NP-046 WT:B MT53E1G32D2NP-046 WT:B 32Gb Low Power DDR4 SDRAM (LPDDR4) is a high-speed CMOS dynamic r...
Memory IC Chip MT53E1G64D4HJ-046 AAT:A Automotive 64G LPDDR4 Memory IC Product Description Of MT53E1G64D4HJ-046 AAT:A MT53E1G64D4HJ-046 AAT:A is a high-speed CMOS dynamic random access memory. LPDDR4 memory is ...
... CMOS dynamic random access memory. The memory device is designed in multi-chip package (MCP) and package stack (PoP) to save PCB space. The LPDDR4 memory device optimizes x16, x32, and x64 configurations to...
Memory IC Chip MT53E1G64D4NW-046 WT:C 64 Gbit SDRAM LPDDR4 Memory IC 432-VFBGA Product Description Of MT53E1G64D4NW-046 WT:C MT53E1G64D4NW-046 WT:C 64Gb low-power SDRAM (LPDDR4) is a high-speed CMOS dynamic ran...
... mode is reduced to 1/5. These memory devices are designed in multi-chip packages (MCP) and package stacks (PoP) to save PCB space. The LPDDR4 memory device optimizes x16, x32, and x64 configurations to save...