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UL recognized Thermal Conductive Pad, grey Silicone sheet 45 Shore 00 1.5W/mK for High speed mass storage drives The TIF100-15-02S Series thermally conductive interface materials are applied to fill the air gap...
High Dielectric Strength Thermal Conductive Pad For Telecommunication Hardware The TIF150-30-19S thermally conductive interface materials are applied to fill the air gaps between the heating elements and the he...
yellow LCD / LED High Thermally Conductive Pad , Heatsink Cooling Conductive Rubber Sheet 3.0W/mK -50 to 200 The TIF180-30-19S thermally conductive interface materials are applied to fill the air gaps between ...
Grey Cooling Electronic Ultra Soft Thermal Conductive Pad , silicone rubber sheet 1.5w/mk with 60 shore00 hardness The TIF120-15-02F thermally conductive interface materials are applied to fill the air gaps bet...
Ultra Soft Low Thermal Conductivity Materials PAD Light Green 3.5 MHz Dielectric Constant The TIF120-20-07U thermally conductive interface materials are applied to fill the air gaps between the heating elements...
Blue Soft Thermal Gap Filler 1.5w / Mk For Automotive Engine Control Units UL RoHs The TIF100 Series thermally conductive interface materials are applied to fill the air gaps between the heating elements and t...
High Power LED lights Thermal Gap Filler , 5.5 MHz Dielectric Constant Heat Sink Material Pad 3.0 W/mK for LED The TIF120FG-30-25S thermally conductive interface materials are applied to fill the air gaps betwe...
Grey 2.5 W / mK Compressible Conductive Heatsink Thermal Gap Filler With Adhesive Backing 60 Shore 00 The TIF™100-25-10F thermally conductive interface materials are applied to fill the air gaps between the hea...
2.54mm Thickness Ultrasoft Thermally Conductive Polymers Gap For CPU Heatsink Cooling The TIF100-15-07E thermally conductive interface materials are applied to fill the air gaps between the heating elements and...
High Power LED Lights Thermal Gap Fillers , Glass Fiber Backing Conductive Silicone Rubber The TIF120FG-30-25S thermally conductive interface materials are applied to fill the air gaps between the heating eleme...
Pink 3.0W/mK Flexibility Thermal Conductive Pad TIF150-30-49U for Heat Housing at LED-lit 30 shore00, -40 to 160 The TIF150-30-49U thermally conductive interface materials are applied to fill the air gaps betw...
Pink high conductivity 3.0 W/mK thermal conductive pad 30 shore 00 soft silicone gap filler for LED ceiling light The TIF160-30-49U Series thermally conductive interface materials are applied to fill the air g...
Naturally Tacky Rubber Gap Filler Thermally Conductive Interface Materials 3.0 W/MK The TIF150-30-05S thermally conductive interface materials are applied to fill the air gaps between the heating elements and t...
3.0 W/MK Silicone Thermal Conductive Pad For Telecommunication Hardware -50 to 200 The TIF150-30-19S thermally conductive interface materials are applied to fill the air gaps between the heating elements and t...
yellow Automotive Engine Control Units Thermal Gap Filler Replace Bergquist Gap Pad TIF400 The TIF400 Series thermally conductive interface materials are applied to fill the air gaps between the heating elemen...
Semiconductor automated test equipment (ATE) Thermal Gap Filler For High Speed Mass Storage Drives The TIF100-12E thermally conductive interface materials are applied to fill the air gaps between the heating el...
Compressible Thermal Gap Filler For Semiconductor Automated Test Equipment, High tack surface reduces resistance The TIF100-12F thermally conductive interface materials are applied to fill the air gaps between ...
Semiconductor automated test equipment (ATE) Ziitek Thermal Gap Filler in MB application TIF100-02S The TIF100-02S thermally conductive interface materials are applied to fill the air gaps between the heating e...
Non Toxic 3.0 g/cc Thermal conductive Pad TIF100-30-11S 3.0W / mK For Micro Heat Pipe 45 shore00 The TIF100-30-11S Series thermally conductive interface materials are applied to fill the air gaps between the he...
...Thermal Pad 4.0W/MK With 45 Shore 00 Hardness For RDRAM Memory Modules The TIF100-40-11S Series is recommended for applications that require a minimum amount of pressure on components. The viscoelastic natur...