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Ball Grid Array Rework

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Total 746 products for ball grid array rework Manufacture & Suppliers

35um BGA PCB Assembly

... devices such as microprocessors. It can reduce package size and integrating a greater number of functions on a single chip module. BGA also replaces solder balls on the component underside for SMT mounting....

Shenzhen Shinelink Technology Ltd
Guangdong,China

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Hard Drive Double Sided PCB Assembly Services Of LED Lighting

..., sinking gold, minimum hole 0.2MM Dielectric: FR-4 Flame retardant performance: V0 Package form: fine pitch ball grid array packaging technology Product Name:...

Shenzhen Yizhuo Electronics Co., Ltd
China

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STMicroelectronics ST Ics Microcontroller STM8S207S6 SMD/SMT Mounting

ST Hot sale electronic components STM8S207S6 bridge rectifier microcontroller ic chip ball grid array integrated circuit STM8S207S6T6C The STM8S207S6T6C is a microcontroller unit based on a high-performance ARM...

ShenZhen QingFengYuan Technology Co.,Ltd.
China

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Highly Customizable IC Test Sockets Featuring Spring Loaded Pins Or Pogo Pins With Thermal Solution For Testing Performance

... Sockets are essential in ensuring accurate performance verification of integrated circuits (ICs) across a wide range of package types, including BGA (Ball Grid Array), QFP...

Sireda Technology Co., Ltd.
China

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Semi Automatic BGA Reballing Machine WDS 800 for PCB Positioning and Folding

Make PCB positioning folding welding Full Automatic BGA Rework Sation WDS-800 Specification Max PCB Size W650*D610mm PCB Thickness 0.5-8mm BGA Size 1*1-80*80mm Min.ball pitch 0.15mm Max Weight of BGA 150g Place...

Shenzhen Wisdomshow Technology Co.,ltd
China

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Microcontroller MCU MIMX8DX1AVOFZAC i.MX 8DualXPlus FBGA417 Applications Processors

... i.MX 8DualXPlus FBGA417 Applications Processors Product Description Of MIMX8DX1AVOFZAC MIMX8DX1AVOFZAC fine-pitch ball grid array package, 417 terminals, 0.8 mm pitch, i.MX 8DualXPlus Applications Processo...

ShenZhen Mingjiada Electronics Co.,Ltd.
China

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Microcontroller MCU MIMX8ML6CVNKZAB i.MX 8M Plus Quad Microprocessor Chip 548LFBGA

...MIMX8ML6CVNKZAB MIMX8ML6CVNKZAB is i.MX 8M Plus Quad Microprocessor Chip, low profile, fine-pitch, ball grid array package, 548 terminals, 0.5 mm pitch. Specification Of MIMX8ML6CVNKZAB Part Number: MIMX8ML6...

ShenZhen Mingjiada Electronics Co.,Ltd.
China

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Microcontroller MCU MIMX8MN5DVPIZAA TBGA306 i.MX 8M Nano UltraLite Quad 4 Core

...MIMX8MN5DVPIZAA MIMX8MN5DVPIZAA is i.MX 8M Nano UltraLite Quad Microprocessors IC, thin ball grid array package, 306 terminals, the package is 306-TFBGA (11x11). Specification Of MIMX8MN5DVPIZAA Part Number ...

ShenZhen Mingjiada Electronics Co.,Ltd.
China

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Microcontroller MCU 1.4GHz MIMX8MN5CVPIZAA TBGA306 4 Core Microprocessors IC

... MCU 1.4GHz MIMX8MN5CVPIZAA TBGA306 4 Core Microprocessors IC Product Description Of MIMX8MN5CVPIZAA MIMX8MN5CVPIZAA TBGA306, thin ball grid array package, 306 terminals, i.MX 8M Nano UltraLite Quad Applica...

ShenZhen Mingjiada Electronics Co.,Ltd.
China

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i.MX 8M Nano SoloLite MIMX8MN1DVTJZAA Microcontroller MCU 1 Core 1.5GHz LFBGA486

... Real-time integrity checker (RTIC), i.MX 8M Nano SoloLite. The package is LFBGA486, low profile fine-pitch ball grid array. Specification Of MIMX8MN1DVTJZAA Part Number MIMX8MN1DVTJZAA Video/Display feature...

ShenZhen Mingjiada Electronics Co.,Ltd.
China

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Microcontroller MCU MCIMX7S3DVK08SD i.MX 7Solo Processors TFBGA488 1 Core

...®-A7 and Cortex-M4 Cores. Package is TFBGA488, plastic, thin fine-pitch ball grid array. Specification Of MCIMX7S3DVK08SD Part Number MCIMX7S3DVK08SD USB USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1) Voltage - I/...

ShenZhen Mingjiada Electronics Co.,Ltd.
China

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Microprocessors Chip MCIMX7U3CVP06SD LFBGA393 Low Power Microcontroller MCU

...-power. The package is LFBGA393, low profile fine-pitch ball grid array. Specification Of MCIMX7U3CVP06SD Part Number: MCIMX7U3CVP06SD Number Of Cores/Bus Width: 1 Core, 32-Bit Operating Frequency(Max): 650M...

ShenZhen Mingjiada Electronics Co.,Ltd.
China

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1.5GHz LS1027AXE7PQA Dual Core 64Bit Microprocessors Chip 448FBGA Circuit Chip

... enabled. Package is FBGA448, fine-pitch ball grid array package. Product Attributes Of LS1027AXE7PQA Part Number: LS1027AXE7PQA Qualification Tier: Industrial Core Type Arm: Cortex-A72 Number Of ......

ShenZhen Mingjiada Electronics Co.,Ltd.
China

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Microprocessors IC LS1017ASN7PQA FBGA448 Single Core Processors Chip 1.5GHz

...Description Of LS1017ASN7PQA LS1017ASN7PQA is Single Core 1.5GHz Processors Chip, FBGA448, fine-pitch ball grid array package. Two high-speed USB 2.0/3.0 controllers with integrated PHY. Product Attributes ...

ShenZhen Mingjiada Electronics Co.,Ltd.
China

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10Gbps Ethernet Chip AQC113-B1-C Integrated Circuit Chip FCBGA224 Ethernet Controllers

..., Single-port Size: 12 Mm X 14 Mm Pitch: 0.8 Mm Pitch Package: 224-pin, Flip-chip Ball Grid Array (FCBGA)...

ShenZhen Mingjiada Electronics Co.,Ltd.
China

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MT47H64M16HR-25E:H High Performance 45Byte Flash Memory Chips

...t is ideal for a variety of applications. It features a 16M x 16-bit configuration and is available in a 204-pin ball grid array package. It is capable of supporting up to 400 MHz clock speeds and offers hig...

Shenzhen Sai Collie Technology Co., Ltd.
China

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MT40A256M16LY-062E:F Flash Memory Ic Chip 8Gb DDR3-1600 CL11 204-Pin SO-DIMM

MT40A256M16LY-062E:F Flash Memory Chips Product Specifications: • Capacity: 256Mb (16M x 16) • Package: Ball Grid Array (BGA) • Temperature Range: Standard (0°C to +70°C) • Interface: DDR2 • Memory Organization...

Shenzhen Sai Collie Technology Co., Ltd.
China

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Programmable IC Chip EP1C6Q240I7N - High-Performance FPGA For Embedded Systems

EP1C6Q240I7N Programmable IC Chip Product Parameters: �� Operating Voltage: 3.3V �� Maximum Clock Frequency: 66 MHz �� Programmable I/O Pins: 240 �� Package: Ball Grid Array �� Number of Configurable Logic Cells: 8,...

Shenzhen Sai Collie Technology Co., Ltd.
China

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Programmable IC Chip EP1C4F400C8N 400K Gates 144-Pin TQFP 10.5ns Tpd

... IC Chip Parameters: - Number of Logic Cells: 4,400 - Speed: 133 MHz - Package: 144-Pin Fine Pitch Ball Grid Array - Voltage Supply Range: 1.14V - 1.26V - Maximum Power Consumption: 4.8W - Number of I/O Pins...

Shenzhen Sai Collie Technology Co., Ltd.
China

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EP1C12F324I7N Programmable IC Chip - High Performance And Reliable Solution

Product Listing: EP1C12F324I7N Programmable IC Chip Description: EP1C12F324I7N is a programmable integrated circuit (IC) chip manufactured by Altera. It features 324-pin, plastic ball grid array (BGA) package, ...

Shenzhen Sai Collie Technology Co., Ltd.
China

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