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... IC Chip Parameters: - Number of Logic Cells: 4,400 - Speed: 133 MHz - Package: 144-Pin Fine Pitch Ball Grid Array - Voltage Supply Range: 1.14V - 1.26V - Maximum Power Consumption: 4.8W - Number of I/O Pins...
Product Listing: EP1C12F324I7N Programmable IC Chip Description: EP1C12F324I7N is a programmable integrated circuit (IC) chip manufactured by Altera. It features 324-pin, plastic ball grid array (BGA) package, ...
... for Complex Logic Applications XC2C512-10FGG324I Programmable IC Chip • Package: 324-Pin FG Fine-Pitch Ball Grid Array • Speed Grade: 10 • Number of Logic Cells: 512 • Number of Macrocells: 8 • Clock Manage...
... Block RAM: 12.5 Mbits • Power Management Modes: Multiple • Package: Flip-Chip Ball Grid Array (FCBGA) • Speed Grade: -2 • User Flash Memory: 8 Mbits • Maximum Frequency: 435 MHz • Number of Clock Managers: ...
... PCB, Flex, Rigid-flex, MPCB,HDI bare board ※ Surface Mount Assembly (SMT) ※ Through Hole Technology (THT) ※ Ball Grid Array (BGA) assembly and inspection ※ Wire harness & cable assembly ※ Box Build and Fina...
...Assembly (SMT) 3) Through Hole Technology (THT) 4) Ball Grid Array (BGA)/QFN/DFN assembly and Xray inspection 5) Wire harness & cable assembly 6) Box Build and Final assembly 7) Lead-......
...: 1) PCB, Flex, Rigid-flex, MPCB,HDI bare board 2) Surface Mount Assembly (SMT) 3) Through Hole Technology (THT) 4) Ball Grid Array (BGA)/QFN/DFN assembly and Xray inspection 5) Wire harness & cable assembly...
...: 1) PCB, Flex, Rigid-flex, MPCB,HDI bare board 2) Surface Mount Assembly (SMT) 3) Through Hole Technology (THT) 4) Ball Grid Array (BGA)/QFN/DFN assembly and Xray inspection 5) Wire harness & cable assembly...
..., 13485 :2016, IATF 16949 : 2016, UL 476377 certified. 5. Lead free, ROHs and Reach compliant ,Halogen-free. 6. Ball Grid Array(BGA)/0201 chips assembly. 7. Test in-house(ICT/FT High-pot/E-test etc) 8. A tea...
..., 13485 :2016, IATF 16949 : 2016, UL 476377 certified. 5. Lead free, ROHs and Reach compliant ,Halogen-free. 6. Ball Grid Array(BGA)/0201 chips assembly....
... PCB, Flex, Rigid-flex, MPCB,HDI bare board ※ Surface Mount Assembly (SMT) ※ Through Hole Technology (THT) ※ Ball Grid Array (BGA) assembly and inspection ※ Wire harness & cable assembly ※ Box Build and Fina...
... (THT) ※ Ball Grid Array (BGA) assembly and inspection ※ Wire harness & cable assembly ※ Box Build and Final assembly ※ Lead-Free,RoHS,Reach ......
..., 13485 :2016, IATF 16949 : 2016, UL 476377 certified. 5. Lead free, ROHs and Reach compliant ,Halogen-free. 6. Ball Grid Array(BGA)/0201 chips assembly. 7. Test in-house(ICT/FT High-pot/E-test etc) 8. A tea...
.../write speeds of up to 400MB/s, making it ideal for applications requiring fast data access and reliable storage. Featuring a compact BGA (Ball Grid Array...
..., 13485 :2016, IATF 16949 : 2016, UL 476377 certified. 5. Lead free, ROHs and Reach compliant ,Halogen-free. 6. Ball Grid Array(BGA)/0201 chips assembly. 7. Test in-house(ICT/FT High-pot/E-test etc) 8. A tea...
...: 1) PCB, Flex, Rigid-flex, MPCB,HDI bare board 2) Surface Mount Assembly (SMT) 3) Through Hole Technology (THT) 4) Ball Grid Array (BGA)/QFN/DFN assembly and Xray inspection 5) Wire harness & cable assembly...
... MultiMedia Card) is an embedded non-volatile storage solution. It integrates NAND flash chips and flash controllers into a small BGA (Ball Grid Array) package, providing devices with a highly integrated, lo...
... assembly line. This specific profile is engineered to accommodate 90% of all standard-height components, including popular packages such as BGA (Ball Grid Array), CSP (Chip Scale Package), TQFP (Thin Quad F...
...: 1) PCB, Flex, Rigid-flex, MPCB,HDI bare board 2) Surface Mount Assembly (SMT) 3) Through Hole Technology (THT) 4) Ball Grid Array (BGA)/QFN/DFN assembly and Xray inspection 5) Wire harness & cable assembly...
...: 1) PCB, Flex, Rigid-flex, MPCB,HDI bare board 2) Surface Mount Assembly (SMT) 3) Through Hole Technology (THT) 4) Ball Grid Array (BGA)/QFN/DFN assembly and Xray inspection 5) Wire harness & cable assembly...