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... Block RAM: 12.5 Mbits • Power Management Modes: Multiple • Package: Flip-Chip Ball Grid Array (FCBGA) • Speed Grade: -2 • User Flash Memory: 8 Mbits • Maximum Frequency: 435 MHz • Number of Clock Managers: ...
... component, possibly a FCTEBGA (Flip Chip Thin Exposed Die Ball Grid Array) package [2]. The specific details about its functionality or application are not mentioned in the search results. Manufacturer: The...
... PCB, Flex, Rigid-flex, MPCB,HDI bare board ※ Surface Mount Assembly (SMT) ※ Through Hole Technology (THT) ※ Ball Grid Array (BGA) assembly and inspection ※ Wire harness & cable assembly ※ Box Build and Fina...
...Assembly (SMT) 3) Through Hole Technology (THT) 4) Ball Grid Array (BGA)/QFN/DFN assembly and Xray inspection 5) Wire harness & cable assembly 6) Box Build and Final assembly 7) Lead-......
...: 1) PCB, Flex, Rigid-flex, MPCB,HDI bare board 2) Surface Mount Assembly (SMT) 3) Through Hole Technology (THT) 4) Ball Grid Array (BGA)/QFN/DFN assembly and Xray inspection 5) Wire harness & cable assembly...
...: 1) PCB, Flex, Rigid-flex, MPCB,HDI bare board 2) Surface Mount Assembly (SMT) 3) Through Hole Technology (THT) 4) Ball Grid Array (BGA)/QFN/DFN assembly and Xray inspection 5) Wire harness & cable assembly...
..., 13485 :2016, IATF 16949 : 2016, UL 476377 certified. 5. Lead free, ROHs and Reach compliant ,Halogen-free. 6. Ball Grid Array(BGA)/0201 chips assembly. 7. Test in-house(ICT/FT High-pot/E-test etc) 8. A tea...
..., 13485 :2016, IATF 16949 : 2016, UL 476377 certified. 5. Lead free, ROHs and Reach compliant ,Halogen-free. 6. Ball Grid Array(BGA)/0201 chips assembly....
... PCB, Flex, Rigid-flex, MPCB,HDI bare board ※ Surface Mount Assembly (SMT) ※ Through Hole Technology (THT) ※ Ball Grid Array (BGA) assembly and inspection ※ Wire harness & cable assembly ※ Box Build and Fina...
... (THT) ※ Ball Grid Array (BGA) assembly and inspection ※ Wire harness & cable assembly ※ Box Build and Final assembly ※ Lead-Free,RoHS,Reach ......
..., 13485 :2016, IATF 16949 : 2016, UL 476377 certified. 5. Lead free, ROHs and Reach compliant ,Halogen-free. 6. Ball Grid Array(BGA)/0201 chips assembly. 7. Test in-house(ICT/FT High-pot/E-test etc) 8. A tea...
..., 13485 :2016, IATF 16949 : 2016, UL 476377 certified. 5. Lead free, ROHs and Reach compliant ,Halogen-free. 6. Ball Grid Array(BGA)/0201 chips assembly. 7. Test in-house(ICT/FT High-pot/E-test etc) 8. A tea...
...: 1) PCB, Flex, Rigid-flex, MPCB,HDI bare board 2) Surface Mount Assembly (SMT) 3) Through Hole Technology (THT) 4) Ball Grid Array (BGA)/QFN/DFN assembly and Xray inspection 5) Wire harness & cable assembly...
... represented by the ball grid array packaging chip size packaging came out,IC carrier as a new packaging carrier came into being IC board is developed on the basis of ......
...maximum PV array open circuit voltage of 500VDC. This makes it ideal for use with larger solar arrays, which can be used to power homes and businesses. The inverter also has a DC input voltage of 24V, which ...