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... Voltage - Supply 2.7 V ~ 3.6 V Operating Temperature -40°C ~ 85°C (TA) Package / Case 64-LBGA Supplier Device Package 64-Fortified BGA (13x11) Shipment UPS/EMS/DHL/FedEx Express. Condtion New original facto...
... Interface Parallel Voltage - Supply 2.7 V ~ 3.6 V Operating Temperature -40°C ~ 85°C (TA) Package / Case 48-VFBGA Supplier Device Package 48-BGA (6x8) Shipment UPS/EMS/DHL/FedEx Express. Condtion New origin...
... Interface Parallel Voltage - Supply 2.7 V ~ 3.6 V Operating Temperature -40°C ~ 85°C (TA) Package / Case 48-VFBGA Supplier Device Package 48-BGA (6x8) Shipment UPS/EMS/DHL/FedEx Express. Condtion New origin...
... Interface Parallel Voltage - Supply 2.7 V ~ 3.6 V Operating Temperature -40°C ~ 85°C (TA) Package / Case 48-VFBGA Supplier Device Package 48-BGA (6x8) Shipment UPS/EMS/DHL/FedEx Express. Condtion New origin...
... Interface Parallel Voltage - Supply 2.7 V ~ 3.6 V Operating Temperature -40°C ~ 85°C (TA) Package / Case 48-VFBGA Supplier Device Package 48-BGA (6x8) Shipment UPS/EMS/DHL/FedEx Express. Condtion New origin...
... Interface Parallel Voltage - Supply 2.7 V ~ 3.6 V Operating Temperature -40°C ~ 85°C (TA) Package / Case 48-VFBGA Supplier Device Package 48-BGA (6x8) Shipment UPS/EMS/DHL/FedEx Express. Condtion New origin...
... Interface Parallel Voltage - Supply 2.7 V ~ 3.6 V Operating Temperature -40°C ~ 85°C (TA) Package / Case 48-VFBGA Supplier Device Package 48-BGA (6x8) Shipment UPS/EMS/DHL/FedEx Express. Condtion New origin...
... Interface Parallel Voltage - Supply 2.7 V ~ 3.6 V Operating Temperature -40°C ~ 85°C (TA) Package / Case 48-VFBGA Supplier Device Package 48-BGA (6x8) Shipment UPS/EMS/DHL/FedEx Express. Condtion New origin...
... Interface Parallel Voltage - Supply 2.7 V ~ 3.6 V Operating Temperature -40°C ~ 85°C (TA) Package / Case 48-VFBGA Supplier Device Package 48-BGA (6x8) Shipment UPS/EMS/DHL/FedEx Express. Condtion New origin...
... footprint technologies. From standard FPGAs to complex Micro-BGAs (0.2mm pitch) and Package-on-Package (PoP) stacking, we possess the equipment and process maturity to ensure reliable interconnections. The ...
... Code: unknown JESD - 30 : S - PBGA - B1357 code The number of terminals :1357 Packaging body material Plastic Encapsulate the code BGA Encapsulation equivalent code BGA1357,37X37,40 Packaging shape :SQUARE ...
TMS320C5535AZHH10 IC DSP FIXED-POINT 144BGA Pbfree Code Yes Rohs Code Yes Part Life Cycle Code Obsolete Ihs Manufacturer TEXAS INSTRUMENTS INC Part Package Code BGA Package Description BGA, BGA144,14X14,32 Pin ...
...package, FCCSP package, NandFlash memory substrate,Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,uMCP,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;Smart phone -.Lap top (Ultra thin...
...package, FCCSP package, NandFlash memory substrate,Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,uMCP,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;Smart phone -.Lap top (Ultra thin...
...package, FCCSP package, NandFlash memory substrate,Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,uMCP,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;Smart phone -.Lap top (Ultra thin...
...package, FCCSP package, NandFlash memory substrate,Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,uMCP,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;Smart phone -.Lap top (Ultra thin...
BT IC AB1526P BT 5.0 Dual Mode Chip AB1526 Audio Single Chip BGA Package Product Description AB1526P is an advanced single-chip solution which integrates baseband and radio for intensive audio applications. It ...
... IC Product Description Of BCM89531B1BPBG BCM89531B1BPBG is second generation of fully integrated BroadR-Reach® multilayer switch solutions to support automotive qualification. Specification Of BCM89531B1BPB...
...IC Product Description Of 88Q2221MA0-NYA2A0G1 88Q2221MA0-NYA2A0G1 transceiver implements the Ethernet physical layer portion of 1000BASE-T1 as defined by the IEEE 802.3bp standard. Specification Of 88Q2221MA...
... supporting Managed Flash Revision 5.1 Standard. It has a total memory capacity of 8GB and comes in a 153 ball BGA package. It is build of MLC technology NAND Flash (1 dies of 64Gb inside) and is made for an...