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... bronzecontact coating: Au or Sn, surpass 50μ '' Ni 2.54 mm pitch 2xx Pin SIP integrated circuit IC sockets adaptor solder Features:1...
... bronzecontact coating: Au or Sn, surpass 50μ '' Ni 2.54 mm pitch 2xx Pin SIP integrated circuit IC sockets adaptor solder Features:1...
XC6SLX9-2FTG256C XC6SLX9-FTG256 XC6SLX9 BGA original XC6SLX9-2FTG256C XC6SLX9-2FT256C BGA256 IC Datasheet Product Spartan-6 Series XC6SLX9 Number of Logic Elements 9152 LE Adaptive Logic Modules - ALMs 1430 ......
Integrated IC socket with full gold circular hole IC socket directly inserted in DIP SINGLE-chip chip circular hole base The foot base of IC can be inserted into the circuit socket of DU collection zhi. It is a...
XC6SLX9-2FTG256C XC6SLX9-FTG256 XC6SLX9 BGA original XC6SLX9-2FTG256C XC6SLX9-2FT256C BGA256 IC Datasheet Product Spartan-6 Series XC6SLX9 Number of Logic Elements 9152 LE Adaptive Logic Modules - ALMs 1430 ......
Double Row Male Header Connector Screw Machine Socket Strip Round Pin IC Sockets Double Row Screw Machine Socket Strip Dip IC Sockets Integrated Circuit Sockets Specifications Row Spacing 7.62 mm Insulator Mate...
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Unicomp close tube AX7900 X-ray system with FPD tilting view for SMT EMS BGA IC Cable & wires qualtiy inspection Specifications of AX7900 X-ray system: System Summary Footprint 1200(W)1200(D)1500(H)mm Machine...
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EP4CE30F23I7N BGA-484 New and origianl parts IC chips In Stock EP4CE30F23C8N EP4CE30F23C6N EP4CE30F23I7N Mfr. #: EP4CE30F23I7N Specification: Description FPGA - Field Programmable Gate Array FPGA - ......
... use chips soldered directly to the printed circuit board, as the chips never need to be removed. Some applications, however, use IC sockets, which allow chips to be inserted and removed without the use of a...
SIP Socket 15.24mm IC Socket Connectors Round DIP SMT Type Female Header Strip SIP Socket 15.24mm IC Socket Connectors Round DIP SMT Type Female Header Strip Specifications Housing (black) Glass-filled thermopl...
EP4CE30F23I7N BGA-484 New and origianl parts IC chips In Stock EP4CE30F23C8N EP4CE30F23C6N EP4CE30F23I7N Mfr. #: EP4CE30F23I7N Specification: Description FPGA - Field Programmable Gate Array FPGA - ......
...ICs) CSR1000A04-IQQM-R CSR8311A08 CSR8610A04-IBBC-R CSR8610B04-IBBC-R CSR QUALCOMM QFN BGA Integrated Circuits Components Specification :CSR1000A04-IQQM-R CSR8311A08 CSR8610A04-IBBC-R CSR8610B04-IBBC-R Categ...
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Robot welding station wds750 repair laptop mobile phone replace chipset hot air smd bga rework welding Product Description Technical parameters of WDS-750 cpu chips removal Power Up heater power:1200W,Down heat...
Press-Fit IC Socket 2.54mm Solderless Press-Fit Mount Copper Alloy Contacts What is the press-fit IC socket connector? A press-fit IC socket is a solderless connector designed to mount integrated circuits (ICs)...
7.62mm Row space Dual-In-Line Circular Connector IC Sockets for PCB Applications 7.62mm Row space Dual-In-Line Circular Connector IC Sockets for PCB Applications Specifications Housing material Black glass-fill...
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Black MPPO ESD Component Tray 7.62mm Thick For BGA IC Devices Secure, stackable, and fully traceable, our JEDEC trays streamline logistics in fast-paced manufacturing environments. JEDEC trays is a ......