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#detail_decorate_root .magic-0{width:750px}#detail_decorate_root .magic-1{overflow:hidden;width:750px;height:869.6202531645571px;margin-top:0;margin-bottom:0;margin-left:0;margin-right:0}#detail_decorate_root ....
... in laptop, mobile phone, xbox360,ps3,etc. The main user is repairing shops and factory to provide the after-sales service and rework. How to separate BGA chip from motherboard? How to replace a new BGA chip...
... in laptop, mobile phone, xbox360,ps3,etc. The main user is repairing shops and factory to provide the after-sales service and rework. How to separate BGA chip from motherboard? How to replace a new BGA chip...
Our Advantages 1.120pcs material stations -- can meet the mounting requirements of various materials and various specifications and packages of the product. 1) 120pcs 8mm material stations support NXT electric ...
Our Advantages 1.120pcs material stations -- can meet the mounting requirements of various materials and various specifications and packages of the product. 1) 120pcs 8mm material stations support NXT electric ...
What's the parameter of WDS-660? Total Power Max 6600W Upper Heating Power 1200W Lower Heating Power Second zone: 1200W, Third zone: IR 4200W Power Supply (Single Phase)AC 110V/220V10V 50Hz3Hz 5.4 KVA Machine...
#detail_decorate_root .magic-0{vertical-align:top}#detail_decorate_root .magic-1{vertical-align:top;display:block;padding-right:4px;box-sizing:border-box;padding-left:4px}#detail_decorate_root .magic-2{vertical...
#detail_decorate_root .magic-0{vertical-align:top}#detail_decorate_root .magic-1{vertical-align:top;display:block;padding-right:4px;box-sizing:border-box;padding-left:4px}#detail_decorate_root .magic-2{vertical...
LP200 vacuum pen Anti-satic IC Pick-up Vacuum Sucker Pen + 2 Suction Headers for BGA SMD Work Reballing Aids skype:sensenhenhao,wp/wc:+8613424013606 Vacuum Sucker Pen Specifications: .Suction headers are provid...
VIRTUAL suction pen Anti-satic IC Pick-up Vacuum Sucker Pen + 5 Suction Headers for BGA SMD Work Reballing Aids skype:sensenhenhao,wp/wc:+8613424013606 Vacuum Handing Pen details: PAN-VAC JUNIOR ESD 1.Clear alu...
... tin,OSP… Components Passives down to 0201 size BGA and VF BGA Leadless Chip Carriers /CSP Double -sided SMT Assembly Fine Pitch to 08 Mils BGA Repair and Reball Part Removal and replacement-Same days servic...
... silver,immersion tin,OSP… Components Passives down to 0201 size BGA and VF BGA Leadless Chip Carriers /CSP Double -sided SMT Assembly Fine Pitch to 08 Mils BGA Repair and Reball Part Removal and replacement...
...,ENIG,immersion silver,immersion tin,OSP… Components Passives down to 0201 size BGA and VF BGA Leadless Chip Carriers /CSP Double -sided SMT Assembly Fine Pitch to 08 Mils BGA Repair and Reball Part Removal ...
...Components Passives down to 0201 size BGA and VF BGA Leadless Chip Carriers /CSP Double -sided SMT Assembly Fine Pitch to 08 Mils BGA Repair and Reball Part Removal and replacement-Same days service Max size...
... tin,OSP… Components Passives down to 0201 size BGA and VF BGA Leadless Chip Carriers /CSP Double -sided SMT Assembly Fine Pitch to 08 Mils BGA Repair and Reball Part Removal and replacement-Same days servic...
...Components Passives down to 0201 size BGA and VF BGA Leadless Chip Carriers /CSP Double -sided SMT Assembly Fine Pitch to 08 Mils BGA Repair and Reball Part Removal and replacement-Same days service Max size...
... and Thru-hole 2 Solder Type Water Soluble Solder Paste,Leaded and Lead-Free 3 Components Passives Down to 0201 Size BGA and VFBGA Leadless Chip Carries/CSP Double-Sided SMT Assembly Fine Pitch to 08 Mils BG...
... and Thru-hole 2 Solder Type Water Soluble Solder Paste,Leaded and Lead-Free 3 Components Passives Down to 0201 Size BGA and VFBGA Leadless Chip Carries/CSP Double-Sided SMT Assembly Fine Pitch to 08 Mils BG...
... Type Water Soluble Solder Paste,Leaded and Lead-Free 3 Components Passives Down to 0201 Size BGA and VFBGA Leadless Chip Carries/CSP Double-Sided SMT Assembly Fine Pitch to 08 Mils BGA Repair and Reball Par...
... SMT,Thru-hole Solder Type Water Soluble Solder Paste,Leaded and Lead-Free Components Passive Down to 0201 size BGA and VFBGA Leadless Chip Carriers/CSP Double-sided SMT Assembly Fine Pitch to 0.8mils BGA Re...