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... SMT Machine Features 1.High speed and intelligent, ultra performance adopt high speed multi modular head, apply to ultra small chip 0201-40*40mm large chip, wider component range improve recognition perform...
... SMT Machine Features 1.High speed and intelligent, ultra performance adopt high speed multi modular head, apply to ultra small chip 0201-40*40mm large chip, wider component range improve recognition perform...
... SMT Machine Features 1.High speed and intelligent, ultra performance adopt high speed multi modular head, apply to ultra small chip 0201-40*40mm large chip, wider component range improve recognition perform...
Machine main features Adopt High speed multi modular head, apply to ultra small chip 0201~40*40mm large chip, wider component range; Brand new flight vision camera improve recognition performance, size up to 40...
Unicomp 130kV microfocus X-ray AX9100 for Led PCBA soldering Void measurement Features: 90-130KV 7m X-Ray tube. High speed & Millions pixels high resolution FPD. 1000X magnification, high-definition real...
Application SMT, BGA, CSP, Flip Chip, LED Detection, Semiconductor, Packaging components, Battery Industry, Electronic components, Automotive parts, Photo-voltaic, Aluminium Die-casting, Moulding Plastic. Ceram...
Application Semiconductor, Packaging components, Battery Industry, Electronic components, Automotive parts, Photo-voltaic, SMT, BGA, CSP, Flip Chip, LED Detection Ceramics, other special industries. Aluminium D...
FPD 100KV X Ray Inspection System For Capacitor Function & Features Large Size Inspection Table Laser Locator for Precise Location 24 FHD Interactive Touch LCD Display Accurate Control, CNC ProgrammingAutomat...
Micro Focus Electronics X Ray System For Capacitor Internal Defects Control Application Fields Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casti...
Factory manufacturer of 90kV closed tube 5 um high resolution X-ray equipment for electronics Cable connector harness broken crack twrist quality inspection Application Fields Widely applied for BGA , CSP , Fli...
X-Ray Inspection Equipment Product Description: Widely applied for BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Aerospac...
Unicomp X-ray AX9100vs Multi-mode 3D Micro-focus X-ray Analyze Inspection System Application BGA, CSP, LED, Flip Chip; Automotive Components and New Energy Industry; Aluminum Die casting ,molded plastic; Cerami...
Unicomp X-ray AX8300 Plus Semiconductor Microfocus X-ray Inspection Equipment Application BGA, CSP, LED, Flip Chip; Automotive Components and New Energy Industry; Aluminum Die casting ,molded plastic; Ceramic p...
Unicomp X-ray AX8300VS Multi-mode 3d Micro-focus X-ray Analyze Inspection System Application BGA, CSP, LED, Flip Chip; Automotive Components and New Energy Industry; Aluminum Die casting ,molded plastic; Cerami...
CX300 Unicomp Gold Bond Inspection Equipment 90kV 5m Resolution Bonding Wire Semiconductor X-ray Tester for precise inspection and quality control. Applications BGA, CSP, LED, Flip Chip, Semiconductor, Battery...
Boost y assembly line efficiency with compact tabletop pick and place machine HWGC High speed HW-DSQ800-120F pick and place machine Smt pcb production assembly pasted 0201 BGA smt aoi machine 8 groups of indepe...
...-oven. It can be used for effectively soldering various SMD and BGA components. The whole soldering process can be completed automatically and it is very easy to use. This machine uses a powerful infrared em...
X Ray Detection Equipment , BGA Void Inspection Machine 220AC / 50Hz Application: This X Ray Detection Equipment suits for Inpestion of BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Indus...
... In-circuit Test Function Test Min Chip 0201 chip Glue,Burn-in Conformal Coating Fine-pitch 0.20mm BGA Re-work BGA ball size 0.28mm H 高 ◆SMT+ICT+THT+FT ◆SMT+ICT+THT+Harness+Assembly+FT ◆SMT machine(for...
...circuit Test Function Test Min Chip 0201 chip Glue,Burn-in Conformal Coating Fine-pitch 0.20mm BGA Re-work BGA ball size 0.28mm Technology Involved: H 高 ◆SMT+ICT+THT+FT ◆SMT+ICT+THT+Harness+Assembly+FT ◆SMT ...