| Sign In | Join Free | My burrillandco.com |
|
...color LED module Description Product name WS2812 5050 RGB Built-in 16 Round Full-color LED Module Quick details This product is specially designed for the extended line Ardui 5050 full color LED modules. Sma...
...color LED Wall Washer RGBW Waterproof Stage Light Specifications: Operating Voltage 90-240VAC, 50-60 Hertz Light Source 18pcs 10W RGBW Quad color 4 in 1 LEDs, Each LED have RGBW colors Power 180W IP Rated IP...
... and enhances the color reproduction of conventional TFT-LCDs. It is a technology that addresses the two main issues of a standard twisted nematic (TN) TFT display: color and viewing angle. If you would like...
... and enhances the color reproduction of conventional TFT-LCDs. It is a technology that addresses the two main issues of a standard twisted nematic (TN) TFT display: color and viewing angle. If you would like...
CNLINKO YF-24 20A 3 pin Connector Waterproof Powercon for Outdoor Full Color Led Display Product Description Specifications Specifications Connecting mode Latching Lock connect Protection level IP44/IP65 Cable ...
3 Wire T Shaped Outdoor Waterproof Connector For Colorful LED Wall Washers Features 1. T type waterproof connectors 2. Multicore: 2,3,4 pin available 3. Connection method: push locking 4. Dustproof cover availa...
Two arms double arms light Professional Salon/Spa Eyelash Light Machine Beauty Instruments dual arm Eyelash Extensions Overview for Facial Beauty Fill Lights: 1. With a high Color Rendering Index (CRI) of 95ra,...
...Led Video Screen /Full Color Indoor Advertising Led Display Product Features 1. IPoster is a kind of mirror HD Led display for the advertisement for luxury shopping store, brand-store, 4S Auto-shop,etc. 2. S...
Part No KEM-40011-BSR Dimension 122*90*15mm Digit height 101.6mm Surface color Black/gray Segment color White / clear Emitting color super red(620630nm) Luminous intensity 100mcd/chip Pin configuration Common ...
New 2020 GOB COB high refresh rate over 3840HZ Exhibition LED Screen P1.56 P1.667 P1.923 Advertising Led Screens GOB Technology Introduction 1. Cabinet size: 400*300mm; 2. Lightweight and slim design; 3. 100% f...
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin ...
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin ...
... 8kg per cabinet, it saves freight cost and portable, very easy to move; Easy and fast install and disassemble: unique design of directing pins, catch locks and double safety hoisting devices make the instal...
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin ...
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin ...
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin ...
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin ...
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin ...
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin ...
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin ...