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... configuration: H: 4.28 cm (1.68 in), W: 48.23 cm (18.98 in), D: 70.05 cm (27.57 in) Processor Intel® Xeon® processor E5-2600 v4 product family Processor sockets 2 Cache 2.5MB per core; core options: 4, 6, 8...
... high-speed data transfer rate to run your most demanding applications. Powered by 4th and 5th Gen Intel® Xeon® Scalable Processors with up to 64cores, 8 TB of memory, and 20 EDSFF drive as well as increased...
..., and availability. The HPE ProLiant DL580 Gen10 server supports Intel® Xeon® Scalable processors with up to 28% performance enhancement¹, delivering processing capabilities far superior to previous generati...
... -40°-85° Product packaging LQFP/PowerSSO/HTSSO etc,Please contact us for details. Thank you very much FAQ Q1: How long is your delivery time? A: Group buying delivery time: 30-60 days; General delivery time...
EP3C40F780C8N BGA-780 Product Description XT interconnect technology for superior thermal performance Enhanced avalanche capability SMD package for direct integration to PCB Sense pins for optimized switching p...
EP2C20F484C7N FBGA-484(23x23) Product Description XT interconnect technology for superior thermal performance Enhanced avalanche capability SMD package for direct integration to PCB Sense pins for optimized swi...
EP3C10E144I7N EQFP-144 Product Description XT interconnect technology for superior thermal performance Enhanced avalanche capability SMD package for direct integration to PCB Sense pins for optimized switching ...
EPM3128ATI100-10N TQFP-100 Product Description XT interconnect technology for superior thermal performance Enhanced avalanche capability SMD package for direct integration to PCB Sense pins for optimized switch...
EPM1270F256C5N FBGA-256 Product Description XT interconnect technology for superior thermal performance Enhanced avalanche capability SMD package for direct integration to PCB Sense pins for optimized switching...
10M04SCU169C8G UBGA-169(11x11) Product Description XT interconnect technology for superior thermal performance Enhanced avalanche capability SMD package for direct integration to PCB Sense pins for optimized sw...
EPM570F100I5N FBGA-100(11x11) Product Description XT interconnect technology for superior thermal performance Enhanced avalanche capability SMD package for direct integration to PCB Sense pins for optimized swi...
EP2C20F256I8N FBGA-256 Product Description XT interconnect technology for superior thermal performance Enhanced avalanche capability SMD package for direct integration to PCB Sense pins for optimized switching ...
5CEFA7F27I7N FBGA-67 Product Description XT interconnect technology for superior thermal performance Enhanced avalanche capability SMD package for direct integration to PCB Sense pins for optimized switching pe...
EP2S30F672I4N FBGA-672 Product Description XT interconnect technology for superior thermal performance Enhanced avalanche capability SMD package for direct integration to PCB Sense pins for optimized switching ...
X58 Mainboard Intel Chipset Computer Motherboard X58 LGA 1366 Integrated Introduction: CPU Supports LGA1366 Inte Core i7 / LGA1366 Inte XEON Chipset Inte X58+ICH10 Memory Supports DDR3 1333/1066/800 memory ...
... graphic cards, Size: 595*194 mm Specifications Model No. ETH-YB9C-X79-60 CPU Support LGA2011 Intel®Xeon E5 processors(2pcs same...
..., Intel® Optane™ DC Persistent Memory Expansion Slots Up to 3 PCIe 3.0 Drive Bays Up to 10x 2.5" (including optional 4x direct-......
... rate of 4800MT/s and a maximum memory capacity of 8TB Permanent memory Intel ® Odo ® durable memory support Memory controller Optional Tri-mode (NVMe/SAS/SATA) HPE Smart Array ......
Tech Specs Form Factor/Height 1U rack server Processor Up to 2x 5th Gen Intel® Xeon® Scalable processors, up to 64 cores and 350W TDP Drive Bays Up to 4x 3.5” or 12x 2.5” or 16x EDSFF E1.S drives Front: up to ....
Tech Specs Form Factor/Height 1U rack server Processor Up to 2x 5th Gen Intel® Xeon® Scalable processors, up to 64 cores and 350W TDP Drive Bays Up to 4x 3.5” or 12x 2.5” or 16x EDSFF E1.S drives Front: up to ....