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...Thermal Conductivity Epoxy Glue For Electronic Potting Compound Epoxy Product Summary: TIETM380-25 is a one component, heat cured epoxy adhesive. lt has excellent thermal conductivity and bond strength. TIET...
...Thermally Conductive Silicone Adhesive TIS™580-12 Series is dealcoholized, 1 component, room temperature cure thermally conductive silicone adhesive. It possesses good heat conduction and adhesion towards el...
...Thermally Conductive Silicone Adhesive TIS™580-20 Series is dealcoholized, 1 component, room temperature cure thermally conductive silicone adhesive. It possesses good heat conduction and adhesion towards el...
...Thermally Conductive Silicone Adhesive TIS™580-10 Series is dealcoholized,one component, room temperature cure thermally conductive silicone adhesive. lt possesses good heat conduction and adhesion towards e...
... of components after curing. Flame retardant, high and low temperature resistance from -50ºC to 250ºC (58°F to 432°F). Excellent electrical properties and Thermal conductivity. *...
...Ceramic Flange Ceramic Insulator Polishing Surface Features: 1) A variety of specifications available. 2) Satisfy various technical request 3) Lower medium spoilage 4) Good insulation performance and high te...
...Ceramic Flange Ceramic Insulator Polishing Surface Features: 1) A variety of specifications available. 2) Satisfy various technical request 3) Lower medium spoilage 4) Good insulation performance and high te...
...Ceramic Fiber Board for Industrial Furnace , Low Thermal Conductivity Product description: Ceramic fiber board is produced with different alumina-silica fibers for applications at temperatures up to 1400 ºC ...
...Thermal Conductivity 8.0W Thermal Conductive Gel For Telecom Industry TIF®080-11 is a soft silicone gel-based gap filler pad, formulated with a special blend of fillers to provide both excellent thermal cond...
...good thermal conductivity of 1.1 W/mK with high conformability, this gap filler produces low thermal resistance. The alumina filler allows the product to remain a cost effective solution where moderate therm...
... thermal conductivity of 1.1 W/mK with high conformability, this gap filler produces low thermal resistance. The alumina filler allows the product to remain a cost effective solution where moderate thermal p...
...used for thick film integrated circuits. Alumina ceramics have better conductivity, mechanical strength and high resistance. The company has an independent plant, self-produced and sold, perfect technology a...
... conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2 products, CD-ROM ,LCD TV, ......
Good Quality Best Price UL High Conductivity Thermal Conductive Pad 2W 2.75 G/Cc For Devices And Heat Sink The TIF140-20-12E thermally conductive interface materials are applied to fill the air gaps between the...