| Sign In | Join Free | My burrillandco.com |
|
Tantalum Chip Engineering Kits T491B106K016AT Description KEMET is offering six Tantalum Chip Engineering Kits to meet your diverse design needs for the future. KEMET’s line of Engineering Kits for Tantalum Chi...
... 14S12P Lighting Area 25*35MM CHIPS VERTICAL(LG or SEOUL SEMI) LENS QUARTZ GLASS LENS SUBSTRATE ALN Coppering Design Advantage: High effiency 40%-50% Ingorganic encapsulation Multi wavelength 365nm/385nm/395...
...Chip High Power led cob full spectrum 100W LED COB models LN-AFR110FS-P100AC-50H Electronic power 100W Color temperature 380-780nm VF AC220V±10V IF 0.45A Circuit 81S2P(F2235 CHIP) WHOLE SIZE R110mm EMIT SIZE...
...(F2235 CHIP) WHOLE SIZE 40*60mm EMIT SIZE 25x25MM Power Efficacy >0.85 Design Advantage : Epistar & Epiled chip. Low thermal resistance <0.58C/W. Multi wavelength. Various spectrum. Driver & LED all in one design. Q1: Do you supply OEM,ODM service? A1:...
...Chip Power 40W-60W/50W-80W IF 1100-1500mA/1350-2200mA VF 35-38V View Angle 120° Substrate Super-Aluminum Design Advantage High density CRI 70/80/90/95 LM/W 120-140 CCT 2700-6500K Circuit 12S8P/12S12P Learnew...
...Chip Hub Controller IC PCBA Design Our USB Type-C peripheral chip adopts high-speed transmission technology, which can achieve faster data transmission and faster charging, making your device connection more...
...Design High Speed Drive USB Interface Chip Development Our USB Type-C peripheral chip provides a more efficient and convenient connection method for your device. Not only does it support data transmission an...
...Chip R50mm High Power LED 100W indoor plant 90-130umol/s 370-780nm spectrum models LN-AFR110FS-P100AC-50H Electronic power 100W Color temperature 380-780nm VF AC220V±10V IF 0.45A Circuit 81S2P(F2235 CHIP) WH...
...Chip High Power LED R110mm 150W indoor plant 120-150umol/s 380-780nm spectrum models LN-AFR110FS-P150AC-50H Electronic power 150W Color temperature 380-780nm VF AC220V±10V IF 0.65A Circuit 81S2P(F2235 CHIP) ...
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin ...
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin ...
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin ...
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin ...
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin ...
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin ...
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin ...
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin ...
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin ...
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin ...
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin ...